Search Results - electrical+%3e+computing+hardware

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Accurate Compute-In-Memory Accelerator With Multi-Level Analog Weight Storage (Case No. 2026-169)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a high-density, multi-level CTT-based compute-in-memory architecture that enables precise, energy-efficient analog computation directly within memory for high-performance computing. Background: Conventional digital processors for artificial intelligence...
Published: 6/3/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali, Samyak Chakrabarty, Vinod Kurian Jacob
Keywords(s): Advanced Computing / AI, advanced computing methods, AI, AI hardware, analog computing, Artificial Intelligence, artificial intelligence accelerators, Artificial Neural Network, CMOS, compute-in-memory, edge computing, Energy Efficiency, high-performance computing, Memory, parallel computing, Transistor, transistors
Category(s): Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors > Memory
Calibration of Analog Multi-Bit Storage Elements Without Off-Chip Components (Case No. 2026-167)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a scalable, energy-efficient technique for high-precision threshold voltage tuning and verification in charge trap transistor arrays using low-overhead on-chip measurement. Background: Charge trap transistors (CTTs) enable non-volatile analog multi-bit...
Published: 6/3/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali
Keywords(s): analog computing, CMOS, compute-in-memory, Electrical, Electrical Engineering, Integrated Circuit, large-area arrays, low latency computing, Memory, Network Analysis (Electrical Circuits), Neuromorphic circuits, programming, pulsed load modulation, scalable fabrication, soft electrical circuits
Category(s): Electrical, Electrical > Computing Hardware, Energy & Environment, Energy & Environment > Energy Efficiency, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors
1-Micron Optical-To-Microwave Frequency Division System for Low Phase Noise Microwave Generation (Case No. 2026-042)
Summary: UCLA researchers in the Department of Electrical & Computer Engineering have designed an integrated, chip-scale architecture that generates ultra-pure, highly tunable microwave signals via microcombs. Background: Ultra-low phase noise and highly tunable microwave signals are critical for next-generation technological infrastructure....
Published: 5/29/2026   |   Updated: 5/29/2026   |   Inventor(s): Chee Wei Wong, Dong IL Lee, Wenzheng Liu
Keywords(s): Extremely High Frequency, Frequency conversion, frequency modulation, high frequency electronics, high-frequency signals, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Monolithic Microwave Integrated Circuit, Radio Frequency, Radio Frequency Coil Human Factors And Ergonomics, Radio Frequency Sine Wave, radiofrequency (RF) coil, Radiofrequency Ablation, radiofrequency signaling, RFID (Radio Frequency Identification)
Category(s): Electrical, Electrical > Signal Processing, Electrical > Quantum Computing, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors
Superconducting Diodes for Qubit Readout (Case No. 2026-079)
Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...
Published: 3/3/2026   |   Updated: 2/24/2026   |   Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger
Keywords(s):  
Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials
Superconducting Diodes for Qubit-Qubit Coupling (Case No. 2026-078)
Summary: UCLA researchers in the Department of Electrical Engineering have developed a superconducting diode-based nonreciprocal interconnect that enables low-loss, directional microwave signal routing between qubits, chips, and cryogenic modules while preserving quantum coherence and suppressing back-propagating noise. Background: Scalable superconducting...
Published: 3/3/2026   |   Updated: 2/24/2026   |   Inventor(s): Prineha Narang, Nicolas Dirnegger, Arpit Arora
Keywords(s): Communication & Networking, cryogenic cooling, device architectures, Diode, Electrical Impedance, entanglement, Microwave, Network On A Chip, quantum communication, Quantum Computer, quantum network, quantum processing, quantum processor, scalable communication, transmission enhancement
Category(s): Electrical, Electrical > Quantum Computing, Electrical > Computing Hardware, Energy & Environment > Energy Transmission, Electrical > Signal Processing
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Multi-Level Scheduling and Partitioning of Reconfigurable Processor Arrays (Case No. 2026-011) Circular Elevator Style Network-on-Chip (Case No. 2026-012) and Pattern Compilation for Runtime Reconfigurable Arrays (Case No. 2026-013)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a high-speed runtime reconfigurable processor array (RTRA) that enables on-chip scheduling and rapid multi-program execution with unprecedented energy and area efficiency for dynamic computing workloads. Background: Dynamic digital signal processing...
Published: 12/11/2025   |   Updated: 12/11/2025   |   Inventor(s): Dejan Markovic, Hong Seok Lee, Chenkai Ling
Keywords(s): computational efficiency, computational efficiency and analysis, edge computing, energy-efficient, Hardware, high speed, large-area arrays, low latency computing, low-power architecture, Microarray, Microprocessor, processor design, programming, scalable manufacturing, System On A Chip
Category(s): Electrical > Signal Processing, Electrical, Electrical > Electronics & Semiconductors, Software & Algorithms, Electrical > Computing Hardware
CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...
Published: 12/12/2025   |   Updated: 12/10/2025   |   Inventor(s): Mau-Chung Chang, Jhih-Wei Chen
Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors
Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms
Monitoring Structural Health Using Diffractive Optical Processors (Case No. 2025-201)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel structural health monitoring system that is highly accurate and cost effective, addressing limitations in current infrastructure and civil health monitoring and a rise in public safety concerns. Background: The need for structural health monitoring...
Published: 12/5/2025   |   Updated: 12/5/2025   |   Inventor(s): Aydogan Ozcan, Ertugrul Taciroglu, Yuntian Wang, Yuhang Li
Keywords(s): 3D structures, Adaptive Optics, AI-generated images and content, all-optical diffractive computing, all-optical transformation, analog computing, analog optical computing, Analogue Electronics, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, artificial intelligence algorithms, artificial intelligence augmentation, artificial intelligence/machine learning models, artificial-intelligent materials, civil engineering, civil infrastructure, civil monitoring, computational imaging, computational imaging task, Construction, deep diffractive network, Diffraction, diffractive design, diffractive image reconstruction, diffractive network, diffractive processor, diffractive surface, digital image reconstruction, electromagnetic spectrum, Electro-Optics, Image Analysis, Image Processing, Image Resolution, image restoration, image signal processing, Imaging, Infrastructure, Lens (Optics), linear optics, Nanostructure, optical processor, optically-guided structural monitoring, Optics, passive light-matter interactions, security imaging, Signal Reconstruction, Structural health monitoring, structural health monitoring (SHM), structure monitoring, Structures
Category(s): Electrical, Electrical > Signal Processing, Electrical > Imaging, Materials, Materials > Construction Materials, Electrical > Visual Computing, Electrical > Computing Hardware, Electrical > Instrumentation, Energy & Environment, Energy & Environment > Energy Efficiency, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Image Processing, Software & Algorithms > Programs
Prototype Software for Neuron-Centric Memory Architecture in AI (Case Nos. 2025-327/328)
Summary: Researchers at UCLA’s Department of Integrative Biology & Physiology and Neurobiology have pioneered the first prototype of a novel, neuron-centric AI architecture featuring intracellular memory and adaptive computation capabilities, designed to enhance deep learning performance and efficiency. Background: Deep learning leverages...
Published: 12/10/2025   |   Updated: 10/23/2025   |   Inventor(s): Alain Glanzman, David Glanzman
Keywords(s): Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, artificial intelligence algorithms, artificial intelligence augmentation, artificial intelligence/machine learning models, artificial intelligence-generated content, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, generative artificial intelligence, Medical artificial intelligence (AI), Neuron, neurons, Software, Software & Algorithms, Software Development Tools, Software-enabled learning
Category(s): Software & Algorithms, Software & Algorithms > AI Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical, Electrical > Computing Hardware
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