Search Results - semiconductors

38 Results Sort By:
Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 2/23/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Deuterized Low-K Dielectric Materials for TDDB Mitigation
Simple, scalable and inexpensive process to replace the hydrogen in low-k dielectrics with deuterium to improve semiconductor performance. Background: Low-k dielectrics are a class of materials used in the manufacture of nanoscale semiconductor devices. The problem with low-k dielectrics is that they are susceptible to a phenomenon known as time dependent...
Published: 1/30/2026   |   Inventor(s): James Lloyd, Patrick Lenahan, Niaz Mahmud
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Campus > SUNY Polytechnic Institute
Phase-Controlled High Power Class AB MMIC Amplifier for X-Band Applications
This technology introduces a high-power Class AB monolithic microwave integrated circuit (MMIC) power amplifier designed for X-band radar and advanced communication systems. It is based on Gallium Nitride (GaN) on Silicon Carbide (SiC) technology, which provides high breakdown voltage and excellent thermal conductivity. This design improves load modulation,...
Published: 1/29/2026   |   Inventor(s): Abdullah Eroglu, M.D Tanvir
Keywords(s): MMIC Amplifiers, power semiconductor devices, radar, semiconductors, Technologies
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Electronics
CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...
Published: 12/12/2025   |   Inventor(s): Mau-Chung Chang, Jhih-Wei Chen
Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors
Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms
Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...
Published: 10/23/2025   |   Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang
Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors
Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking
Frequency Alteration and Performance Enhancement of a Resonant MEMS Device and a Resonant MEMS Array
Advantages Improves resonator precision and quality using localized Joule heating Enables post-fabrication tuning without redesign or full re-manufacture Enhances performance by lowering motional resistance and boosting Q factor Works with a wide range of MEMS materials and device shapes Summary MEMS resonators are widely used in precision...
Published: 1/23/2026   |   Inventor(s): Ugur Guneroglu, Jing Wang, Adnan Zaman
Keywords(s): Electronics, Piezoelectric, Semiconductors
Category(s): Technology Classifications > Engineering > Electrical Engineering, Technology Classifications > Engineering > Mechanical Engineering, Technology Classifications > Electronics, Technology Classifications > Engineering
Suspended Graphene Energy Harvesting Solid State Structure
An energy harvesting device made possible by the oscillatory behavior of suspending graphene. Background: Even low power devices need consistent, reliable energy sources that in most cases must be powered indefinitely in order to accomplish the device’s objectives. Maintaining a secure and independent energy source for powering small, sometimes...
Published: 1/30/2026   |   Inventor(s): Nicholas Pieniazek, Christopher Hobbs, Vincent LaBella
Keywords(s): battery systems, circuit design, energy storage devices, material science, microsystem, nanoengineering, nanofabrication, nanotechnology, semiconductors, Technologies
Category(s): Technology Classifications > Energy, Technology Classifications > Environment, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology, Campus > SUNY Polytechnic Institute, Campus > NY CREATES
Semiconductor Annealing Monitoring
Provides real-time, in-situ monitoring of conductivity change in a doped semiconductor wafer that is being subjected to pulsed microwave annealing. Background: Certain semiconductor wafers are manufactured via a process called doping. During this process, a material (the dopant) is introduced into the semiconductor crystal to change its electrical...
Published: 2/3/2026   |   Inventor(s): Fatemeh Shahedipour-Sandvik, Vincent Meyers
Keywords(s): biomedical, chemistry, microsystem, semiconductors, TAF, Technologies
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Electronics, Technology Classifications > Materials and Chemicals
Improved Chemical-Mechanical Polishing Slurry Composition and Method to Improve Polishing of Metals and Non-metals Using Cerium Oxide Nanoparticles
Reducing manufacturing time, cost, and labor by employing chemistry to transform a two-step process into an easily controlled single-step. Background: Integrated circuits are built of many layers. Each layer must be perfectly flat so that connections line up between layers and electricity flows properly throughout. Conventional CMP systems consist...
Published: 1/30/2026   |   Inventor(s): Christopher Netzband, Kathleen Dunn
Keywords(s): abrasive, cerium, cerium oxide, chemical activity, chemical mechanical polishing, CMP, CMP slurries, dielectrics, fiber optics, integrated circuit, lens, mechanical polish, metallic surface, optics, polish, polishing, semiconductor wafers, semiconductors, slurry, surface finishing, surface quality
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology
1 2 3 4