Search Results - scalable+fabrication

6 Results Sort By:
Calibration of Analog Multi-Bit Storage Elements Without Off-Chip Components (Case No. 2026-167)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a scalable, energy-efficient technique for high-precision threshold voltage tuning and verification in charge trap transistor arrays using low-overhead on-chip measurement. Background: Charge trap transistors (CTTs) enable non-volatile analog multi-bit...
Published: 6/3/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali
Keywords(s): analog computing, CMOS, compute-in-memory, Electrical, Electrical Engineering, Integrated Circuit, large-area arrays, low latency computing, Memory, Network Analysis (Electrical Circuits), Neuromorphic circuits, programming, pulsed load modulation, scalable fabrication, soft electrical circuits
Category(s): Electrical, Electrical > Computing Hardware, Energy & Environment, Energy & Environment > Energy Efficiency, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors
Transformer-Based High-Density, Efficient Power Delivery Architecture for Wafer-Scale Integrated Systems (Case No. 2026-075)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transformer-based, high-density power delivery architecture that enables efficient, scalable, and low-loss energy distribution for next-generation wafer-scale and chiplet-based systems. Background: Chiplet-based and wafer-scale integrated systems demand...
Published: 5/15/2026   |   Updated: 5/15/2026   |   Inventor(s): Subramanian Iyer, Goutham Ezhilarasu, Namkang Lee
Keywords(s): analog computing, Artificial Intelligence, Electrical, energy-efficient, high power electronics, high-performance computing, large-area arrays, power conversion efficiency, Power distribution & grids, Power Electronics, Power Transmission, scalable fabrication, Transformer, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Energy & Environment > Energy Efficiency, Energy & Environment
Magnetically Levitated Inertial Sensor Using Split Magnetic Dipoles (Case No. 2026-191)
Summary: Researchers in the UCLA Department of Electrical and Computer Engineering have developed a magnetically levitated inertial sensor based on a split magnetic dipole architecture. The anchorless design enables high quality factor (Q) gyroscopic sensing with independently tunable sensitivity and bandwidth, providing a robust solution for precision...
Published: 4/2/2026   |   Updated: 3/26/2026   |   Inventor(s): Robert Candler, Amy Sihn, Vaibhav Sharma, Martin Simon
Keywords(s): accelerometer, Autonomous driving, Bandwidth (Signal Processing), Communications Satellite, high sensitivity, inertial sensor, interactive sensing application, marine applications, MEMS, micro-electromechanical systems (MEMS), Motion analysis, motion detection, real-time sensing/monitoring/tracking, scalable fabrication, Vibration sensing
Category(s): Electrical, Electrical > Mems, Electrical > Sensors, Mechanical, Mechanical > Micro-Electromechanical Systems (Mems), Mechanical > Sensors, Mechanical > Mechanical Systems
Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...
Published: 3/2/2026   |   Updated: 3/2/2026   |   Inventor(s): Subramanian Iyer, Samuel Wang
Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)
Multilevel Buffered Link (Case No. 2025-284)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel on-chip link that enhances communication performance and energy efficiency in modern integrated circuits. Background: On-chip communication enables data transfer between microchip components and is critical in computing, automotive, and industrial...
Published: 11/17/2025   |   Updated: 8/20/2025   |   Inventor(s): Sudhakar Pamarti, Chih-Kong Yang, Haris Suhail
Keywords(s): Bandwidth (Signal Processing), buffer layer, Clock Signal, efficiency bandwidth products, Electrical, Electrical Engineering, Energy Efficiency, energy efficient IoT, energy-efficient, high-data-rate links, high-speed communications, IoT communication, large bandwidth, low-power device, Network On A Chip, scalable communication, scalable fabrication, Signaling pathways, Signal-To-Noise Ratio, System On A Chip
Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Computing Hardware, Software & Algorithms > Communication & Networking, Electrical > Signal Processing
Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031)
Summary: Researchers in the UCLA Department of Materials Science and Engineering have developed a facile, rapid method to print soft, wearable electronics. Background: Soft electrical circuits have garnered significant interest in a broad range of emerging technologies, including wearable electronics, brain-machine interfaces, and soft robotics....
Published: 3/6/2025   |   Updated: 9/3/2024   |   Inventor(s): Ximin He, Dong Wu
Keywords(s): Coating, Coatings, Adhesives, & Inks, Electronics & Semiconductors, Fabrication Technologies, gallium-based liquid metals, General Device Coatings, Liquid metal particles, liquid metals, Metals, Microelectronics Semiconductor Device Fabrication, Polymer, Polymers, scalable fabrication, Semiconductor Device Fabrication, soft electrical circuits, soft electronics, wearable electronics, wearable sensors
Category(s): Chemical, Chemical > Polymers, Chemical > Coatings, Adhesives & Inks, Electrical, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Instrumentation, Electrical > Flexible Electronics, Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Materials > Metals