Search Results - scalable+fabrication

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Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...
Published: 3/2/2026   |   Inventor(s): Subramanian Iyer, Samuel Wang
Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)
Multilevel Buffered Link (Case No. 2025-284)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel on-chip link that enhances communication performance and energy efficiency in modern integrated circuits. Background: On-chip communication enables data transfer between microchip components and is critical in computing, automotive, and industrial...
Published: 11/17/2025   |   Inventor(s): Sudhakar Pamarti, Chih-Kong Yang, Haris Suhail
Keywords(s): Bandwidth (Signal Processing), buffer layer, Clock Signal, efficiency bandwidth products, Electrical, Electrical Engineering, Energy Efficiency, energy efficient IoT, energy-efficient, high-data-rate links, high-speed communications, IoT communication, large bandwidth, low-power device, Network On A Chip, scalable communication, scalable fabrication, Signaling pathways, Signal-To-Noise Ratio, System On A Chip
Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Computing Hardware, Software & Algorithms > Communication & Networking, Electrical > Signal Processing
Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031)
Summary: Researchers in the UCLA Department of Materials Science and Engineering have developed a facile, rapid method to print soft, wearable electronics. Background: Soft electrical circuits have garnered significant interest in a broad range of emerging technologies, including wearable electronics, brain-machine interfaces, and soft robotics....
Published: 3/6/2025   |   Inventor(s): Ximin He, Dong Wu
Keywords(s): Coating, Coatings, Adhesives, & Inks, Electronics & Semiconductors, Fabrication Technologies, gallium-based liquid metals, General Device Coatings, Liquid metal particles, liquid metals, Metals, Microelectronics Semiconductor Device Fabrication, Polymer, Polymers, scalable fabrication, Semiconductor Device Fabrication, soft electrical circuits, soft electronics, wearable electronics, wearable sensors
Category(s): Chemical, Chemical > Polymers, Chemical > Coatings, Adhesives & Inks, Electrical, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Instrumentation, Electrical > Flexible Electronics, Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Materials > Metals