Search Results - quantum+computer

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A New ADC Architecture (Case No. 2023-276)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel analog-digital conversion (ADC) Architecture that achieves high-speed, high-resolution signal conversion with reduced power consumption and increased linearity. Background: High-speed, high-resolution analog-digital converters (ADCs) are what...
Published: 9/16/2024   |   Inventor(s): Utkarsh Sharma, Behzad Razavi
Keywords(s): Computer Architecture, Consumer Electronics, Digital Electronics, Digital Signal Processing, Integrated Circuit, processor design, quantum communication, Quantum Computer, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, Signal Processing, trapped ion quantum processor
Category(s): Electrical > Signal Processing, Electrical > Computing Hardware
Scalable Multi-Party Networks for High-Rate Entanglement Distribution and Quantum Communications (Case No. 2024-011)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a multiparty network for improved quantum communications. Background: Fully secure quantum networks are essential in achieving efficient and rapid quantum computing. These networks connect distant quantum computers and increase the computational volume...
Published: 6/4/2024   |   Inventor(s): Chee Wei Wong, Murat Sarihan, Xiang Cheng, Kai-Chi Chang
Keywords(s): Communication & Networking, energy-efficient wireless communication, entanglement, multiparty network, quantum communication, Quantum Computer, quantum key, quantum network, quantum processing, quantum processor, scalable communication
Category(s): Electrical, Electrical > Quantum Computing, Electrical > Sensors, Software & Algorithms, Software & Algorithms > Communication & Networking, Software & Algorithms > Security & Privacy
Quantum Cross-Resonator Spectrometer (Case No. 2023-181)
Summary: UCLA researchers in the Division of Physical Sciences and Engineering have developed a novel method of characterizing the complex dielectric function of a material. Background: The complex dielectric function is a measure of a material’s response to static or alternating electromagnetic fields and describes the microscopic behavior...
Published: 9/23/2024   |   Inventor(s): Prineha Narang, Ioannis Petrides, Jonathan Curtis, Amir Yacoby, Marie Wesson
Keywords(s): Quantum Computer, quantum processing, quantum processor
Category(s): Electrical, Materials, Materials > Semiconducting Materials, Electrical > Quantum Computing
Polyqubit Encoding for Quantum Information Processing (Case No. 2023-006)
Summary: UCLA researchers in the Physics and Astronomy Department have developed a quantum information processing method that encodes multiple qubits within single atoms in trapped atom quantum processors, enabling efficient qubit manipulation for enhanced computational capacity. Background: Quantum computing is an emerging technology with immense...
Published: 11/7/2023   |   Inventor(s): Wesley Campbell, Eric Hudson
Keywords(s): advanced computing methods, atomic processor, Electronics & Semiconductors, information storage, polyqubit, polyqubit encoding, polyqubit processing, Quantum Computer, quantum error correction (QEC), quantum processing, quantum processor, qubit-host-limited (QHL), system control resources, trapped ion quantum processor
Category(s): Electrical, Electrical > Quantum Computing
2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal
Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning
Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer
Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer
Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings