Search Results - ferromagnetic+semiconductor

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Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
A General Cation-Exchange Approach to Magnetic Intercalation Superlattices (Case No. 2025-9A1)
Summary: UCLA researchers in the Department of Chemistry have developed a general cation-exchange approach for tunable magnetic intercalation superlattices. Background: Layered materials are crucial for engineering quantum and magnetic phenomena at the atomic scale. Magnetic intercalation superlattices, a type of layered materials, enable tunable...
Published: 7/24/2025   |   Inventor(s): Xiangfeng Duan, Yu Huang, Jingxuan Zhou
Keywords(s): Advanced Computing / AI, advanced packaging, Cation exchange, doping control, Fabrication Technologies, ferromagnetic semiconductor, layered materials, magnetic coupling, magnetic intercalation superlattices, quantum communication, Quantum Computer, quantum computing materials, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, room-temperature superconductivity, spin textures, spintronics, trapped ion quantum processor, tunable ferromagnetism, Van der Waals, Van Der Waals Force, VIN group metals
Category(s): Materials, Materials > Nanotechnology, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Materials > Metals, Optics & Photonics