Search Results - microprocessor

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2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal
Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning
Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer
Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer
Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings
2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors
Summary: UCLA researchers in the department of Electrical and Computer Engineering have developed an on-chip clock propagation circuit that allows creation of large-scale fault-robust processor systems which are essential for the next generation of big data solutions. Background: Waferscale processor systems can provide the large number of cores,...
Published: 12/12/2023   |   Inventor(s): Puneet Gupta, Saptadeep Pal
Keywords(s): Chipset, Clock Signal, Computer Architecture, Electrical Breakdown, Electronics & Semiconductors, Integrated Circuit, Microprocessor, Network On A Chip, Semiconductor, Semiconductor Device, Semiconductors, Supercomputer, System On A Chip
Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors > Circuits
A New Design of Cache Memory in Computers that Improves Performance and Security
Princeton Docket #09-2526-1The invention is a new method of designing cache memories used in computers. It achieves best-in-class performance for various performance metrics, previously achievable only by different conventional cache architectures. In particular, it combines benefits of Fully-Associative caches and Direct-Mapped caches, in a novel way...
Published: 3/26/2024   |   Inventor(s): Ruby Lee, Zhenghong Wang
Keywords(s): computers/software, data security, microprocessor
Category(s): Computer Science and Information Technology
A General-Purpose Parallel Read Functional Unit That Can Accelerate Software AES Encryption and Decryption. Parallel Read Functional Unit for Microprocessor
Princeton Docket #09-2534-1This invention proposes a new functional unit to store constants and tables, and new instructions that can read multiple constants in parallel, to speed up the software processing of various algorithms, including the AES encryption and decryption algorithms. AES is the NIST’s Advanced Encryption Standard (AES) which...
Published: 3/30/2022   |   Inventor(s): Ruby Lee, Yu-Yuan Chen
Keywords(s): computers/software, cyber security, data security, microprocessor
Category(s): Computer Science and Information Technology
HARDWARE TRUST ANCHORS IN SP-ENABLED PROCESSORS
Princeton Docket #09-2495-1 Researchers at Princeton have developed a new device to improve the security of computers, communication devices and entertainment devices. The invention consists of a set of hardware registers and mechanisms that define a small set of fundamental hardware trust anchors, and cryptographic and tagging mechanisms that can...
Published: 12/5/2023   |   Inventor(s): Ruby Lee, Jeffrey Dwoskin
Keywords(s): computers/hardware, data security, microprocessor, system on chip (SOC)
Category(s): Computer Science and Information Technology