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Summary: Iowa State University researchers have discovered a method of breaking down polyesters capable of over 90% monomer recovery at atmospheric pressure and only mildly elevated temperatures. Description: Conventional recycling of polyesters is commonly done via thermomechanical means which limit the useful number of times they can be recycled....

Published: 3/4/2026 | Inventor(s):

Keywords(s):

Category(s): Energy, Cleantech & Environmental, Materials

Method of Making Synthetic Graphite from Polymeric Sources

Summary: Iowa State University and Ames National Laboratory scientists have discovered a new method for producing synthetic graphite with the use of picosecond pulsed lasers. Description: Synthetic graphite is needed for applications such as electrodes in electric arc furnaces or anodes in lithium-ion batteries. Traditional production relies on...

Published: 3/4/2026 | Inventor(s):

Keywords(s):

Category(s): Materials, Ames Laboratory

A method of mechanochemically-assisted extraction of lithium from α-spodumene and other hard-rock minerals

Summary: Ames Laboratory scientists have developed a method of extracting lithium from hard-rock minerals without the need for high temperature roasting and with reduced or eliminated harsh chemical requirements. Description: Lithium-bearing hard-rock minerals, such as α-spodumene, are reactively ball milled to convert the lithium content...

Published: 3/4/2026 | Inventor(s):

Keywords(s):

Category(s): Energy, Cleantech & Environmental, Materials

A method of acid- and water-free direct lithium extraction from α-spodumene and other Li-rich hard rock minerals

Summary: Ames Laboratory scientists have developed a method for extracting lithium from hard-rock mineral sources that eliminates the need for high temperature roasting of the ore and without the use of water or other solvents. Description: Lithium-bearing hard-rock minerals, such as α-spodumene, are reactively ball milled to convert the...

Published: 3/4/2026 | Inventor(s):

Keywords(s):

Category(s): Energy, Cleantech & Environmental, Materials

Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 3/5/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 3/5/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

A Selenium Buffer Method for Making Van Der Waals Contact on CDTE Wafers With High Surface Roughness (Case No. 2025-173)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel method for implementation of Van der Waals contact on commercial CdTe wafers for improved photovoltaic and solar panel production. Background: Cadmium Telluride (CdTe) is a common absorber used for thin-film optoelectronics and photovoltaics, including...

Published: 1/28/2026 | Inventor(s): Yu Huang, Xiangfeng Duan, Bangyao Hu

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Instrumentation & Analysis, Electrical > Sensors, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Materials, Materials > Semiconducting Materials

Θ-Phase Tantalum Nitride for Thermal Management and Electronics Applications (Case No. 2026-180)

Summary: Researchers in UCLA’s Department of Mechanical and Aerospace Engineering have developed a novel transition metal compound that demonstrates what is thought to be the highest thermal conductivity reported among metallic materials. The material is synthesized as a single, defect-free crystal, enabling unprecedented efficiency in heat transport....

Published: 1/20/2026 | Inventor(s): Yongjie Hu

Keywords(s): advanced thermal control materials, Composite Material, Electronics & Semiconductors, energy-efficient, heat control, heat controlling devices, heat dissipation, Heat Transfer, high conductivity, material science, Materials, Metals, nanocrystalline metals, Power Electronics, temperature control, thermal control, thermal control materials, thermal management, thermal management systems, thermal metamaterials

Category(s): Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Synthesis, Electrical, Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment > Thermal, Materials, Materials > Metals, Mechanical > Heat Transfer

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