Search Results - microfabrication

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Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Novel three-dimensional, conformal microelectrode arrays for interrogating and manipulating three-dimensional cell culture systems
A flexible, biocompatible microelectrode array wraps around 3D cell cultures such as organoids, enabling comprehensive electrical recording and stimulation for advanced research, drug testing, and personalized medicine, overcoming the limitations of traditional flat electrode arrays. Background: Three-dimensional (3D) cell culture systems, such as...
Published: 2/18/2026   |   Updated: 1/26/2026   |   Inventor(s): Susan Sharfstein, Nathaniel Cady, Yubing Xie, Natalya Tokranova, Anthony Manning, Fernando Pesantez Torres
Keywords(s): 3D culture, 3D flexible microelectrode, electrophysiology, microelectrode array, microfabrication, neurodegeneration, organoid, polymer materials, Technologies
Category(s): Campus > University at Albany, Technology Classifications > Biomedical Science and Engineering
Self-Assembly of Microscale Parts Using Integrated Micromagnets
Obviates Human or Robotic Action in Assembling Advanced Microscale Electrical ComponentsThis alternative magnetic assembly system integrates the magnets onto micro part surfaces to enable self-assembly. Over the past few decades, electronics and photonic devices have increased in complexity as they have become more integrated. This trend toward more...
Published: 1/20/2026   |   Updated: 5/14/2019   |   Inventor(s): David Arnold
Keywords(s): electronic circuits, components and equipment, magnetic and superconductory materials/device, magnetic bonding, MEMS or microsystems, microfabrication, self-assembly, Semiconductors
Category(s): Technology Classifications > Engineering > Computer Science, Technology Classifications > Engineering > Electrical, Technology Classifications > Engineering > Instrumentation-Sensors-Photonics, Technology Classifications > Engineering > Materials