Search Results - semiconductor

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Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...
Published: 3/2/2026   |   Updated: 3/2/2026   |   Inventor(s): Subramanian Iyer, Samuel Wang
Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...
Published: 12/12/2025   |   Updated: 12/10/2025   |   Inventor(s): Mau-Chung Chang, Jhih-Wei Chen
Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors
Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms
Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...
Published: 10/23/2025   |   Updated: 10/23/2025   |   Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang
Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors
Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking
HgTe Quantum Dots With Near Unity Photoluminescent Quantum Yields in the Near and Short-Wave Infrared (Case No. 2024-256)
Summary: Researchers in UCLA’s Department of Chemistry and Biochemistry have developed an innovative synthesis technique to create ultrasmall Mercury Telluride (HgTe) quantum dots, offering tunable optoelectronic properties and high photoluminescent quantum yields across the infrared spectrum. Background: HgTe quantum dots are gaining popularity...
Published: 9/11/2025   |   Updated: 1/30/2025   |   Inventor(s): Justin Caram, Belle Coffey
Keywords(s): Biochemistry, Chemical, Electronics & Semiconductors, Imaging, Infrared, infrared thermal imaging, Light-Emitting Diode, Materials, Microscale Chemistry, Nanomaterials, nanophotonics, near-infrared, Optoelectronic materials, Optoelectronics, photodetection, photoluminescence, photostability, Quantum Dot, Semiconductor, Semiconductors
Category(s): Electrical > Imaging, Chemical, Optics & Photonics, Materials > Nanotechnology, Chemical > Instrumentation & Analysis, Electrical > Sensors, Materials > Semiconducting Materials
Carrier Storage Frequency Divider Using Silicon PIN Diodes (Case No. 2025-023)
Summary: Researchers in UCLA’s Department of Electrical and Computer Engineering have designed and fabricated an innovative device capable of frequency division at the Terahertz range, featuring low power consumption, quadrature outputs, and high sensitivity. Background: Traditional electronic and optical devices struggle to operate at the...
Published: 12/8/2025   |   Updated: 1/23/2025   |   Inventor(s): Sidharth Thomas, Aydin Babakhani, Benyamin Fallahi Motlagh
Keywords(s): Analogue Electronics, Antennas/Wireless, artificial electromagnetic materials, Bandwidth (Signal Processing), Bioelectromagnetics, bioelectronics, bistable electroactive polymer, Cardiac Electrophysiology, Consumer Electronics, Continuous-Wave Radar, Digital Electronics, Digital Signal Processing, Electrical Engineering, Electroactive Polymers, Electrocatalyst, electrochemical sensors, Electrode, Electrode 3D Printing, electrodeposition, electrodes, Electroencephalography, Electroencephalography (EEG), Electroencephalography Microsecond Neurofeedback, Electrolyte, electromagnetic, Electromagnetism, Electron, electron emittance, Electron Gun, Electronics & Semiconductors, energy-efficient wireless communication, Extremely High Frequency, high-frequency signals, image signal processing, Imaging, Integrated Circuit, low-power device, Optical networks, PIN Diode, power conversion efficiency, Radar, Radar / Antennae, Remote Sensing, Semiconductor, Semiconductor Device, Semiconductors, signal decoding, Signal Processing, Silicon, Synthetic aperture radar (SAR), Wireless, wireless communication, wireless connectivity, Wireless Sensor Network, wireless spectrum
Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Wireless, Electrical > Signal Processing
Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...
Published: 7/17/2025   |   Updated: 3/25/2024   |   Inventor(s): Yuanxun Wang, Jinseong Jeong
Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials
Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 10/20/2025   |   Updated: 2/14/2024   |   Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren
Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation
Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)
Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...
Published: 8/20/2025   |   Updated: 12/19/2023   |   Inventor(s): Yong Chen, Zixuan Rong
Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning
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