Search Results - tiwei+wei

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Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Sunlight-Harvesting Windows for Enhanced Power Generation
Nanoparticle-Embedded Glass Redirects Scattered Light to Solar Cells Within Window Frames that Produce Electricity These sunlight-harvesting windows embedded with metal nanoparticles and framed with photovoltaic cells produce four times as much power as other solar windows. In 2014, the United States installed enough solar photovoltaics to power 4...
Published: 1/20/2026   |   Inventor(s): Wei Wei, Jiangeng Xue
Keywords(s): Harvesting, Infrared Absorption, light scattering, Nanoparticle, Solar Cells, Solar Energy, Transparent
Category(s): Technology Classifications > Engineering > Electrical, Technology Classifications > Engineering > Materials
Synthesis of Star-Shaped Gold Nanoparticles for Solar Power and Biomedical Applications
Plasmonic Gold Nanoparticles Improve Photocatalytic Activity in Solar Cells and Windows or Biomedical Sensing This synthesis process produces gold nano-stars, plasmonic nanoparticles useful as photocatalysts for many applications. The gold nanoparticles market is expected to reach $6.33 billion by 2025; the nanoparticles are in large demand to improve...
Published: 1/20/2026   |   Inventor(s): Wei Wei, Wenxiao Guo
Keywords(s):  
Category(s): Technology Classifications > Engineering > Chemical, Technology Classifications > Others > Cleantech
Photocatalyst for More Efficient Water Oxidation, CO2 Reduction, and Nitrogen Fixation
Drives Photochemical Reactions Powered by Solar Energy and at Low Temperatures This photocatalyst and photolytic process boosts electrochemical efficiency of common industrial reactions, allowing them to occur under solar conditions and low temperatures. The global photocatalyst market is projected to reach $4.58 billion by 2025. Photocatalysts can...
Published: 1/20/2026   |   Inventor(s): Wei Wei
Keywords(s):  
Category(s): Technology Classifications > Engineering > Chemical, Technology Classifications > Others > Cleantech
Enhanced Au/TiO2 Catalysts for More Efficient O2 Activation
Adjusts Atomic Interface to Enable Catalytic Activity 34 Times Greater Than Traditional Catalysts This enhancement of the Au/TiO2 catalyst results from manipulating its interfacial atomic structures for optimal oxygen activation. Analysts project the global market for catalysts to reach $48 billion in 2027 . The field of heterogeneous catalysis does...
Published: 1/20/2026   |   Inventor(s): Wei Wei, Jiawei Huang
Keywords(s):  
Category(s): Technology Classifications > Others > Others
Hybrid Plasmonic Platform for Directing and Controlling Nanostructure Growth
Low-Heat, Bottom-Up Approach Can Produce Metal, Polymer or Bio-Molecule Structures for Catalysis, Biosensors, Electronic Devices and MoreThis surface plasmon mediated chemical solution deposition method uses surface plasmon resonance to deposit nanoparticles in the liquid phase at room temperature to direct and control nanostructure growth. Plasmonic...
Published: 1/20/2026   |   Inventor(s): Jingjing Qiu, Wei Wei
Keywords(s): Catalysts, nanoparticle synthesis, Plasmonic, Thin Films
Category(s): Technology Classifications > Engineering > Chemical, Technology Classifications > Engineering > Materials