Search Results - high-performance+computing

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Transformer-Based High-Density, Efficient Power Delivery Architecture for Wafer-Scale Integrated Systems (Case No. 2026-075)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transformer-based, high-density power delivery architecture that enables efficient, scalable, and low-loss energy distribution for next-generation wafer-scale and chiplet-based systems. Background: Chiplet-based and wafer-scale integrated systems demand...
Published: 5/15/2026   |   Updated: 5/15/2026   |   Inventor(s): Subramanian Iyer, Goutham Ezhilarasu, Namkang Lee
Keywords(s): analog computing, Artificial Intelligence, Electrical, energy-efficient, high power electronics, high-performance computing, large-area arrays, power conversion efficiency, Power distribution & grids, Power Electronics, Power Transmission, scalable fabrication, Transformer, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Energy & Environment > Energy Efficiency, Energy & Environment
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking