Search Results - semiconductors

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Electrically Gated Solid-State Molecular Thermal Transistor (Case No. 2024-099)
Summary: UCLA researchers have introduced a solid-state thermal transistor that achieves groundbreaking performance and facilitates improved heat flow manipulation. Background: The forefront of thermal management is marked by the exploration of molecular thermal transistors, driven by the quest for more efficient electronic devices. Researchers are...
Published: 10/23/2024   |   Inventor(s): Yongjie Hu, Paul Weiss, Man Li
Keywords(s): ; self-assembled molecule, Composite Material, Doping (Semiconductor), Elastic Modulus Thermal Grease, Electronics & Semiconductors, field-effect transistors (FETs), Functional Materials, heat control, heat controlling devices, infrared thermal imaging, Microelectronics Semiconductor Device Fabrication, molecular design, molecular engineering, molecular junction, Nanomaterials, Optoelectronic materials, Optomechanical Thermal Imaging Transducer, organic field effect transistors, Organic Semiconductor, phase change materials, Rechargeable Battery Thermal Conductivity, self-assembled molecule, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, solid-state thermal transistor, strength-thermal stability, switching reversibility, thermal circuit, thermal compression bonding, thermal conductance, Thermal Energy Storage, thermal fusion, thermal imaging, thermal management systems, thermal stability, thermal switching speed, thermal switching speeds, thermal transistor, Thin-Film Transistor, Transistor, transistors, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Energy & Environment, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission, Energy & Environment > Thermal, Electrical > Instrumentation, Materials, Materials > Nanotechnology
Improved Chemical-Mechanical Polishing Slurry Composition and Method to Improve Polishing of Metals and Non-metals Using Cerium Oxide Nanoparticles
Reducing manufacturing time, cost, and labor by employing chemistry to transform a two-step process into an easily controlled single-step. Background: Integrated circuits are built of many layers. Each layer must be perfectly flat so that connections line up between layers and electricity flows properly throughout. Conventional CMP systems consist...
Published: 9/20/2024   |   Inventor(s): Christopher Netzband, Kathleen Dunn
Keywords(s): abrasive, cerium, cerium oxide, chemical activity, chemical mechanical polishing, CMP, CMP slurries, dielectrics, fiber optics, integrated circuit, lens, mechanical polish, metallic surface, optics, polish, polishing, semiconductor wafers, semiconductors, slurry, surface finishing, surface quality
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Materials and Chemicals, Technology Classifications > Nanotechnology
Crystalline Fullerene-Based Semiconductors
­Advantages: Higher Efficiency: C60-2NH3 interlayers increase PCE to 21.64% in mixed Sn-Pb perovskite solar cells. Improved Stability: (C60-2NH3)Pb2I6 reduces traps and defects, maintaining 90% of its initial efficiency after 2400h. Diverse Applications: Extends beyond photovoltaics to catalysis, transistors, and supercapacitors. Summary: This...
Published: 11/5/2024   |   Inventor(s): Ioannis Spanopoulos, Ali Azmy, Zois Syrgiannis, Anamika Mishra
Keywords(s): Nanotechnology, Renewable Energy, Semiconductors
Category(s): Technology Classifications > Electronics > Nanotechnology, Technology Classifications > Energy & Environment, Technology Classifications > Energy & Environment > Energy Engineering, Technology Classifications > Engineering > Electrical Engineering
Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...
Published: 8/19/2024   |   Inventor(s): Yuanxun Wang, Jinseong Jeong
Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials
Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors
A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)
Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...
Published: 10/23/2024   |   Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou
Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials
Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 7/9/2024   |   Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren
Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation
Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)
Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...
Published: 10/22/2024   |   Inventor(s): Yong Chen, Zixuan Rong
Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning
Batteryless, Chipless Millimeterwave RFID Tags (UCLA Case No. 2023-220)
Intro Sentence: UCLA researchers in the Department of Computer Science have developed a chipless and batteryless RFID tag that operates at mmWave frequency and achieves millimeter resolution. Background: Radio frequency identification (RFID) tags have been used for a wide range of applications, such as baggage tracking and item localization in warehouses....
Published: 2/28/2024   |   Inventor(s): Omid Abari, Mohammadreza Pakdeh, Mohammad Hossein Mazaheri Kalahrody
Keywords(s): - Agriculture, Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Chipset, Electronics & Semiconductors, Internet of Things (IoT), Inventory, Inventory Management, Logistics, Millimeterwave network, real-time sensing/monitoring/tracking, RFID, RFID (Radio Frequency Identification), Semiconductor, Semiconductors, Wireless
Category(s): Electrical, Electrical > Wireless > Antennas, Electrical > Wireless, Electrical > Electronics & Semiconductors, Electrical > Sensors
Headar: Sensing Head Gestures for Smartwatches With Wearable Radar (Case No. 2023-265)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed Headar, a wearable radar that can be implemented in smartwatches to detect head gestures. Background: Smartwatches have recently experienced rapid technological advancement and gained a large popularity due to their wide variety of applications features...
Published: 7/9/2024   |   Inventor(s): Yang Zhang, Xiaoying Yang, Eiji Hayashi
Keywords(s): Antennas/Wireless, Consumer Electronics, Electronics & Semiconductors, head gesture, millimeter-wave, Radar, Radar / Antennae, Semiconductor, Semiconductor Device, Semiconductors, Smart Antenna, Smart Material, smart sensing, Smartphone, Smartwatch, wearable
Category(s): Software & Algorithms, Software & Algorithms > Ar/Vr, Electrical, Electrical > Wireless, Electrical > Sensors, Electrical > Wireless > Antennas
Facilitating Security Verification of System Designs Using Adversarial Machine Learning
­Advantages: Enhanced vulnerability identification Efficient verification process Proactive vulnerability detection Business Summary: Businesses seek innovative solutions for growth, efficiency, and digital adaptation amid the pandemic, requiring professional, trustworthy services, open communication, and continuous learning. The difficulties...
Published: 4/24/2024   |   Inventor(s): Hao Zheng
Keywords(s): Artificial Intelligence, Computer Science, Computers Software and Information Technology, Cybersecurity, Data Mining, Electronics, Machine Learning, Semiconductors
Category(s): Technology Classifications > Computer Science, Technology Classifications > Data/AI, Technology Classifications > Data/AI > Cybersecurity - Data/AI, Technology Classifications > Electronics, Technology Classifications > Engineering, Technology Classifications > Engineering > Electrical Engineering, Technology Classifications > Engineering > Computer Engineering, Technology Classifications > Medical > Cybersecurity
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