Search Results - semiconductors

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Multiple Quantum Well Floating Gate Non-Volatile Memory (MQWFGNVM)
This technology is a novel type of non-volatile memory that can store more than two values in a single cell, significantly increasing the amount of data that can be stored. Background: Conventional floating gate non-volatile memory (FGNVM) can store two values (0 or 1) in a single memory cell. The 0 and 1 represent the presence or absence of charge...
Published: 3/13/2026   |   Inventor(s): Supriyo Karmakar
Keywords(s): electronics, MOSFET, nanotechnology, semiconductors
Category(s): Campus > Farmingdale State College, Technology Classifications > Quantum Computing
Micropixel Free Space Optical Space Communications Transceiver
RPI ID: 2017-023-401 Innovation Summary: This invention relates to methods and devices for transceiving light via display devices, enabling bidirectional optical communication. The light source array can operate in multiple duplexing modes: full-space-division, half-space-division, and time-division duplexing. By integrating communication...
Published: 3/10/2026   |   Inventor(s): BASSEM FAHS, Robert, Jr. Karlicek
Keywords(s): 5G Communications, Bioinformatics, Biotechnology, camera/lens, Chip manufacturing, Computer Science, displays, Electrical, Engineering, Integrated circuit, IT Hardware, LED/lighting, LiFi, media, micro-pixel, motion tracking, network management, Optical wireless systems, Photonics, photonics/microelectronics, security, Semiconductors, Sensors, smart systems, terahertz, tranceivers, Video, VLC, wearables
Category(s): Media, Arts, Science and Technology
Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...
Published: 3/2/2026   |   Inventor(s): Subramanian Iyer, Samuel Wang
Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Deuterized Low-K Dielectric Materials for TDDB Mitigation
Simple, scalable and inexpensive process to replace the hydrogen in low-k dielectrics with deuterium to improve semiconductor performance. Background: Low-k dielectrics are a class of materials used in the manufacture of nanoscale semiconductor devices. The problem with low-k dielectrics is that they are susceptible to a phenomenon known as time dependent...
Published: 1/30/2026   |   Inventor(s): James Lloyd, Patrick Lenahan, Niaz Mahmud
Keywords(s): nanotechnology, semiconductors
Category(s): Technology Classifications > Nanotechnology, Campus > SUNY Polytechnic Institute
Phase-Controlled High Power Class AB MMIC Amplifier for X-Band Applications
This technology introduces a high-power Class AB monolithic microwave integrated circuit (MMIC) power amplifier designed for X-band radar and advanced communication systems. It is based on Gallium Nitride (GaN) on Silicon Carbide (SiC) technology, which provides high breakdown voltage and excellent thermal conductivity. This design improves load modulation,...
Published: 1/29/2026   |   Inventor(s): Abdullah Eroglu, M.D Tanvir
Keywords(s): MMIC Amplifiers, power semiconductor devices, radar, semiconductors, Technologies
Category(s): Campus > SUNY Polytechnic Institute, Technology Classifications > Electronics
CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...
Published: 12/12/2025   |   Inventor(s): Mau-Chung Chang, Jhih-Wei Chen
Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors
Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms
Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...
Published: 10/23/2025   |   Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang
Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors
Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking
Frequency Alteration and Performance Enhancement of a Resonant MEMS Device and a Resonant MEMS Array
Advantages Improves resonator precision and quality using localized Joule heating Enables post-fabrication tuning without redesign or full re-manufacture Enhances performance by lowering motional resistance and boosting Q factor Works with a wide range of MEMS materials and device shapes Summary MEMS resonators are widely used in precision...
Published: 1/23/2026   |   Inventor(s): Ugur Guneroglu, Jing Wang, Adnan Zaman
Keywords(s): Electronics, Piezoelectric, Semiconductors
Category(s): Technology Classifications > Engineering > Electrical Engineering, Technology Classifications > Engineering > Mechanical Engineering, Technology Classifications > Electronics, Technology Classifications > Engineering
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