Search Results - instrumentation

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In Vitro Culture Model of Anisotropic to Isotropic Transition
RPI ID: 2015-010-401 / 2015-010-601 Innovation Summary: A hybrid biomaterial platform integrates aligned electrospun fiber regions with adjacent isotropic film surfaces on a single culture substrate, creating a controlled anisotropic‑to‑isotropic boundary that models lesion‑edge transitions found in injured tissues such as spinal cord, tendon, and...
Published: 3/10/2026   |   Inventor(s): Gregory Desmond, Ryan Gilbert, Christopher Rivet, Jonathan Zuidema
Keywords(s): Architecture, Binaural Sound Localization, Biomedical Engineering, Echo Cancellation, Echo suppression, Electrical Engineering, Instrumentation, IT Hardware, Precedence Effect Model, Robotics, Sensors, Simulation and Modeling, Software
Category(s): Biotechnology and the Life Sciences
Efficient Electrode Integration for Microfluidic Diagnostics
Application A manufacturing approach for creating microfluidic devices used in disease modeling, diagnostics, and other lab on a chip applications. Key Benefits Supports high‑performance microfluidic workflows requiring strong, reliable, and reusable device assemblies. Compatible with complex device designs, enabling flexible integration of sensors,...
Published: 2/23/2026   |   Inventor(s): Priscilla Delgado, David Myers, Martin Tomov
Keywords(s): Instrumentation, Lab-on-a-Chip Devices, Micro and Nanotechnology, Microfluidics, Production Methods
Category(s): TechPub Algolia > Diagnostics
Flexible Nanophotonic Cavity-Enhanced Infrared Photodetectors Employing Double Quantum Wells
Double-quantum-well infrared photodetectors (DQWIPs) integrated with nanophotonic cavities enable highly responsive mid-infrared detection through enhanced intersubband absorption in the thin semiconductor heterostructure. Additionally, the technology is compatible with flexible substrates. Background: Quantum Well Infrared Photodetectors (QWIPs)...
Published: 2/19/2026   |   Inventor(s): Peter Liu, Puspita Paul
Keywords(s): Featured, Imaging: Medical Imaging, Instrumentation, Night vision and thermal imaging, Optics, Research Tool, Sensors, Surveillance, Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Electronics, Technology Classifications > Engineering, Technology Classifications > Semiconductor Devices and Manufacturing, Technology Classifications > Quantum Computing
Overcoming Short Channel Barrier Effects of Field Effect Transistors
A design tool for overcoming short channel barrier effects of field effect transistors (FET). Background: The semiconductor industry constantly pushes innovation, demanding research and development into new materials, manufacturing processes, and designs. Silicon is the most widely used semiconductor material in the electronic industry, so there...
Published: 2/19/2026   |   Inventor(s): Hong Luo, Piaohan Xu
Keywords(s): Computer, Featured, General Engineering, Instrumentation, Semiconductor and Microprocessing, Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Computers, Technology Classifications > Engineering, Technology Classifications > Instrumentation, Technology Classifications > Semiconductor Devices and Manufacturing
Robotic Shake Table for Earthquake Research and Education
Shake tables provide a critical tool for simulating earthquake events and testing the response of structures to seismic forces. Simulated earthquake conditions can help civil engineers identify potential weaknesses in the design and suggest ways to improve a structure’s resilience. In a controlled laboratory setting, shake tables can also be...
Published: 2/26/2026   |   Inventor(s): Jnaneshwar Das, Zhiang Chen, Devin Keating, Yash Shethwala, Aravind Saravanakumaran, Ramon Arrowsmith, Christine Wittich
Keywords(s): Educational, Environmental, Geoengineering, Instrumentation, Measurement System, Modeling, Motion Detection, PS-Environmental
Category(s): Educational, Environmental, Physical Science
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 10/20/2025   |   Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren
Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation
2023-123 Systems for Covertly Creating Adverse Health Effects in Subjects
Summary: UCLA researchers in the Division of Physics and Astronomy have developed a less-than-lethal method for covertly creating adverse health effects in human subjects using particular waveforms. Background: Several less-than-lethal techniques for altering or influencing the behavior of target subjects without physical contact have been developed....
Published: 2/14/2025   |   Inventor(s):  
Keywords(s): electromagnetic, Hardware, Instrumentation, Life Science Research Tools, Security and defense, security imaging
Category(s): Life Science Research Tools > Animal Models, Electrical > Sensors, Electrical > Imaging, Medical Devices > Neural Stimulation
Microwave Radiation-Compatible Raman Probe
Microwave-assisted synthesis is a modern method of heating substances rapidly and with high energy efficiency. Applications in solid state chemistry is a growing field of research rapidly gaining popularity with microwave heating being used to synthesize a plethora of inorganic compounds. As a result of its time- and energy-efficiency, it can also...
Published: 2/26/2026   |   Inventor(s): Christina Birkel, Andreas Reitz, John Jamboretz
Keywords(s): Chemical Analysis, Instrumentation, Probe
Category(s): Applied Technologies, Physical Science, Chemical/Biological Sensors
2021-360 PERSONALIZED CONTROL OF HEMODYNAMICS (PCH) IN HIGH-RISK SURGERY PATIENTS
SUMMARY: UCLA researchers have developed a personalized and automated control system of a patient’s hemodynamics during surgery. BACKGROUND: Hemodynamics is the study of blood flow, measuring a variety of inter-connected metrics including oxygenation, cardiac efficiency and output. It provides critical metrics that informs and enables physicians...
Published: 7/17/2025   |   Inventor(s): Chih-Ming Ho, Soban Umar, Jure Marijic, Daniel Garcia, Jinyoung Jeong, Michael Zargari
Keywords(s): Anesthesiology, Artery, Blood Pressure, Hemodynamics, Instrumentation, Kidney, Sensors, Surgery, Surgical Instrument, Surgical Tools
Category(s): Medical Devices, Medical Devices > Surgical Tools
2022-037 PROFILE MONITOR FOR ULTRA-SMALL PARTICLE BEAMS
SUMMARY: UCLA researchers in the Department of Physics and Astronomy have developed a beam profile monitor capable of resolving ultra-small particle beams at sub-micron spot sizes. BACKGROUND: Modern optical applications utilizing ultra-high brightness beams, such as X-ray free electron lasers (XFEL), require monitoring the spatial distributions...
Published: 2/14/2025   |   Inventor(s): Nathan Majernik
Keywords(s): Beam Divergence, Instrumentation, Instrumentation & Analysis, Ion Beam, Laser, Nanotechnology, Optics, Photonics
Category(s): Electrical > Sensors, Materials > Nanotechnology, Optics & Photonics
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