Search Results - advanced+packaging

2 Results Sort By:
A General Cation-Exchange Approach to Magnetic Intercalation Superlattices (Case No. 2025-9A1)
Summary: UCLA researchers in the Department of Chemistry have developed a general cation-exchange approach for tunable magnetic intercalation superlattices. Background: Layered materials are crucial for engineering quantum and magnetic phenomena at the atomic scale. Magnetic intercalation superlattices, a type of layered materials, enable tunable...
Published: 7/24/2025   |   Inventor(s): Xiangfeng Duan, Yu Huang, Jingxuan Zhou
Keywords(s): Advanced Computing / AI, advanced packaging, Cation exchange, doping control, Fabrication Technologies, ferromagnetic semiconductor, layered materials, magnetic coupling, magnetic intercalation superlattices, quantum communication, Quantum Computer, quantum computing materials, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, room-temperature superconductivity, spin textures, spintronics, trapped ion quantum processor, tunable ferromagnetism, Van der Waals, Van Der Waals Force, VIN group metals
Category(s): Materials, Materials > Nanotechnology, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Materials > Metals, Optics & Photonics
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 2/14/2025   |   Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren
Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation