Search Results - materials+%3e+fabrication+technologies

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Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 3/5/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

A Wearable Magnetoelastic Patch for Cervical Spines Care (Case No. 2026-076)

Summary: UCLA researchers have developed a soft, wearable magnetoelastic patch designed for real-time, non-invasive monitoring of cervical spine pressure and motion, enabling early detection and personalized care for infants with potential neck or spine disorders. Background: Infant cervical spine injuries present a significant diagnostic challenge...

Published: 2/4/2026 | Inventor(s): Jun Chen

Keywords(s): Neurosurgery/Spine

Category(s): Diagnostic Markers > Pediatrics, Electrical > Electronics & Semiconductors, Electrical > Flexible Electronics, Electrical > Sensors, Materials > Fabrication Technologies, Mechanical > Sensors, Medical Devices > Monitoring And Recording Systems, Software & Algorithms > AI Algorithms, Therapeutics

Doping of Thorium-229 Into High Bandgap Metal Sulfate Material (Case No. 2025-99Y)

Summary: A UCLA researcher in the Department of Physics has developed a novel method for creating high-bandgap materials doped with thorium-229, enabling the development of advanced nuclear clocks. Background: Thorium-229 is the only known isotope with a nuclear transition low enough to be measured using conventional optical techniques. The combination...

Published: 10/9/2025 | Inventor(s): Eric Hudson

Keywords(s): Clock Signal, high-powered laser systems, Laser, laser alignment, Laser Diode, lasers

Category(s): Materials, Materials > Functional Materials, Optics & Photonics, Optics & Photonics > Lasers, Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Quantum Computing, Energy & Environment, Energy & Environment > Thermal, Materials > Nanotechnology, Materials > Fabrication Technologies, Materials > Semiconducting Materials

Open Metal-Organic Frameworks With Exceptional Pore Apertures for Inclusion of Large Molecules (Case No. 2012-216)

Summary UCLA researchers have developed metal-organic frameworks (MOFs)/isoreticular MOFs (IRMOFs) that have exceptionally large pore apertures, enabling improved capacity and performance in gas storage, separation, and related applications. Background MOFs are porous crystalline materials made of metal nodes and organic linkers; large aperture pores...

Published: 9/22/2025 | Inventor(s): Omar Yaghi, Hiroyasu Furukawa, Hexiang Deng

Keywords(s):

Category(s): Materials, Materials > Metals, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Nanotechnology, Mechanical, Mechanical > Manufacturing

A General Cation-Exchange Approach to Magnetic Intercalation Superlattices (Case No. 2025-9A1)

Summary: UCLA researchers in the Department of Chemistry have developed a general cation-exchange approach for tunable magnetic intercalation superlattices. Background: Layered materials are crucial for engineering quantum and magnetic phenomena at the atomic scale. Magnetic intercalation superlattices, a type of layered materials, enable tunable...

Published: 7/24/2025 | Inventor(s): Xiangfeng Duan, Yu Huang, Jingxuan Zhou

Keywords(s): Advanced Computing / AI, advanced packaging, Cation exchange, doping control, Fabrication Technologies, ferromagnetic semiconductor, layered materials, magnetic coupling, magnetic intercalation superlattices, quantum communication, Quantum Computer, quantum computing materials, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, room-temperature superconductivity, spin textures, spintronics, trapped ion quantum processor, tunable ferromagnetism, Van der Waals, Van Der Waals Force, VIN group metals

Category(s): Materials, Materials > Nanotechnology, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Materials > Metals, Optics & Photonics

Quantitatively Decoding Fatigue Levels with a Self-Powered On-Eyelid Magnetoelastic Sensor (Case No. 2025-110)

Summary: UCLA researchers from the Department of Bioengineering have developed an ultrathin, self-powered, and stretchable sensor that adheres directly to the upper eyelid to track fatigue levels in real time. Background: Fatigue-induced impairments have been widely recognized as major contributors to decreased performance, increased error rates,...

Published: 7/16/2025 | Inventor(s): Jun Chen, Jing Xu

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Sensors, Electrical > Signal Processing, Materials > Fabrication Technologies, Medical Devices > Monitoring And Recording Systems

Circuit Printing Technology Portfolio

Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031) A research team led by Professor Ximin He has developed a facile and scalable fabrication strategy to make soft electronics using LM particles. By using a photo-reactive ink containing LM particles and a polymer precursor, the team can precisely layer conductive surfaces...

Published: 7/17/2025 | Inventor(s):

Keywords(s):

Category(s): Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits

Mechanical Neural Network Driven by Flexure-Based, Meso-Scale, Bidirectional Thermal Actuators (Case No. 2024-235)

Summary: UCLA researchers in the Department of Mechanical Engineering have developed a novel bidirectional thermal linear transducer for active vibration dampening and high precision manufacturing equipment. Background: Metamaterials are engineered structures that demonstrate properties not commonly found in natural materials. To date, most...

Published: 7/2/2025 | Inventor(s): Jonathan Hopkins, Pietro Sainaghi, Michael Cullinan, Andrew Gray

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Construction Materials, Materials > Composite Materials, Mechanical, Mechanical > Aeronautics & Aerospace, Mechanical > Sensors, Mechanical > Micro-Electromechanical Systems (Mems), Mechanical > Mechanical Systems

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