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Search Results - materials+%3e+semiconducting+materials
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A Library of Layered Hybrid Superlattices and Artificial Quantum Solids (Case No. 2024-098)
Summary: UCLA researchers have developed a novel approach for the generation of hybrid superlattices with tunable properties. Background: Heterostructures are composed of two or more semiconductor crystals with interfaces across which chemical makeup changes, and superlattices are simply composed of nanoscale layers that allow quantum confinement...
Published: 8/7/2024
|
Inventor(s):
Xiangfeng Duan
,
Yu Huang
,
Jingyuan Zhou
Keywords(s):
Category(s):
Electrical
,
Electrical > Quantum Computing
,
Materials
,
Materials > Functional Materials
,
Materials > Semiconducting Materials
Prineha Narang Quantum Computing Portfolio
Lab Interview: Quantum Trailblazers: NarangLab’s Pursuit Technology Portfolio: Contracted Quantum Eigensolver for Excited States (Quantum Algorithm) (Case No. 2023-180) Prineha Narang and her team have developed a new quantum algorithm for calculating the excited states using a contracted quantum eigensolver (ES-CQE). ES-CQE uses a contraction...
Published: 3/27/2024
|
Inventor(s):
Prineha Narang
Keywords(s):
Category(s):
Materials
,
Materials > Semiconducting Materials
,
Materials > Functional Materials
,
Electrical
,
Electrical > Quantum Computing
A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)
Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...
Published: 8/8/2024
|
Inventor(s):
Xiangfeng Duan
,
Yu Huang
,
Boxuan Zhou
Keywords(s):
bulk material
,
bulk monolayer
,
chemical dedoping
,
direct bandgap
,
Doping (Semiconductor)
,
Electronics & Semiconductors
,
exciton
,
indirect bandgap
,
intercalated materials
,
Microelectronics Semiconductor Device Fabrication
,
molybdenum disulfide (MOS2)
,
monolayer
,
Optoelectronic materials
,
Organic Semiconductor
,
photoluminescence
,
photon absorption
,
Semiconductor
,
semiconductor chip foundries
,
Semiconductor Device
,
Semiconductor Device Fabrication
,
Semiconductor Ohmic Contact
,
Semiconductor Risk Assessment
,
Semiconductor Sapphire
,
Semiconductors
,
spin polarization
,
valley polarization
,
zzsemiconducting materials
Category(s):
Materials
,
Materials > Functional Materials
,
Materials > Semiconducting Materials
,
Electrical
,
Electrical > Electronics & Semiconductors
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 7/9/2024
|
Inventor(s):
Subramanian Iyer
,
Krutikesh Sahoo
,
Haoxiang Ren
Keywords(s):
advanced packaging
,
advanced packaging constructs
,
dielet assembly
,
dielet bonding
,
Electronic Packaging
,
electronics packaging
,
Fabrication Technologies
,
face-to-face heterogeneous dielet bonding
,
heterogeneous integration
,
heterogenous electronic systems
,
high throughput
,
Instrumentation
,
Interposers
,
Microelectronics Semiconductor Device Fabrication
,
Organic Semiconductor
,
package scaling
,
Semiconductor
,
semiconductor chip foundries
,
Semiconductor Device
,
Semiconductor Device Fabrication
,
Semiconductors
,
thermal compression bonding
,
wafer-scale
,
wafer-scale computing
,
Waferscale Processors
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Electrical > Electronics & Semiconductors > Waferscale Computing
,
Materials
,
Materials > Semiconducting Materials
,
Materials > Fabrication Technologies
,
Electrical > Instrumentation
Quantum Cross-Resonator Spectrometer (Case No. 2023-181)
Summary: UCLA researchers in the Division of Physical Sciences and Engineering have developed a novel method of characterizing the complex dielectric function of a material. Background: The complex dielectric function is a measure of a material’s response to static or alternating electromagnetic fields and describes the microscopic behavior...
Published: 9/23/2024
|
Inventor(s):
Prineha Narang
,
Ioannis Petrides
,
Jonathan Curtis
,
Amir Yacoby
,
Marie Wesson
Keywords(s):
Quantum Computer
,
quantum processing
,
quantum processor
Category(s):
Electrical
,
Materials
,
Materials > Semiconducting Materials
,
Electrical > Quantum Computing
Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)
Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...
Published: 8/22/2024
|
Inventor(s):
Yong Chen
,
Zixuan Rong
Keywords(s):
Application-Specific Integrated Circuit
,
Artifical Intelligence (Machine Learning, Data Mining)
,
artificial electromagnetic materials
,
Artificial Intelligence
,
artificial intelligence augmentation
,
Artificial Neural Network
,
Artificial Neural Network Artificial Neuron
,
artificial-intelligent materials
,
autonomous control
,
computational efficiency
,
edge computing
,
Electronics & Semiconductors
,
Energy Efficiency
,
energy management
,
Integrated Circuit
,
Medical artificial intelligence (AI)
,
Neuromorphic circuits
,
parallel processing
,
parallel signal processing
,
processor design
,
Semiconductor
,
semiconductor chip foundries
,
Semiconductor Device
,
Semiconductors
,
synaptic resistor (synstor)
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Electrical > Signal Processing
,
Materials
,
Materials > Semiconducting Materials
,
Software & Algorithms
,
Software & Algorithms > Artificial Intelligence & Machine Learning
2022-258 Deep Learning-Enabled Detection and Classification of Bacterial Colonies Using a Thin Film Transistor (TFT) Image Sensor
Summary: UCLA Researchers in the Department of Electrical and Computer Engineering have developed a thin-film transistor-based image sensor that can quantify and identify bacterial colony forming units (CFUs) with high accuracy using a deep-learning algorithm. Background: Bacterial infections are a leading cause of death every year in both developed...
Published: 7/19/2023
|
Inventor(s):
Aydogan Ozcan
,
Yuzhu Li
,
Tairan Liu
Keywords(s):
Antibacterial
,
Artificial Neural Network
,
Bacteria
,
Holography
,
Machine Learning
,
Magnetic Resonance Imaging Carotid Artery Stenosis
,
Thin-Film Transistor
,
Transistor
Category(s):
Software & Algorithms
,
Life Science Research Tools
,
Life Science Research Tools > Screening Libraries
,
Materials
,
Materials > Nanotechnology
,
Materials > Semiconducting Materials
,
Life Science Research Tools > Cell Counting And Imaging
2010-241 Single-Mask Double-Patterning Lithography
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a shift-trim double-patterning lithography (ST-DPL) technique to improve the manufacturing of microprocessors and allow for densely-featured patterns. Background: Photolithography is a common method used for the production of various electrical materials...
Published: 9/6/2024
|
Inventor(s):
Puneet Gupta
,
Rani Ghaida
Keywords(s):
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Materials
,
Materials > Semiconducting Materials
,
Electrical > Electronics & Semiconductors > Memory
2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...
Published: 1/10/2024
|
Inventor(s):
Aydin Babakhani
,
Seyedmohammadre Razavian
Keywords(s):
Active Antenna
,
Antenna (Radio)
,
Antenna (Radio) Flip Chip DisplayPort
,
Antennas/Wireless
,
Application-Specific Integrated Circuit
,
Communication & Networking
,
Continuous Wave
,
Continuous-Wave Radar
,
Diode
,
Doping (Semiconductor)
,
Elastomer Static Pressure Pulse Wave
,
Electronics & Semiconductors
,
Frequency conversion
,
Integrated Circuit
,
Integrated Circuit Standing Wave
,
Integrated Circuit Via (Electronics)
,
Laser Diode
,
Light-Emitting Diode
,
Light-Emitting Diode Monochrome Inkjet Printing
,
Microelectronics Semiconductor Device Fabrication
,
Microstrip Antenna
,
Microwave
,
Microwave Base Transceiver Station
,
Microwave Microwave Video Scaler
,
Mixed-Signal Integrated Circuit
,
Monolithic Microwave Integrated Circuit
,
Network Analysis (Electrical Circuits)
,
Optoelectronics Waveguide (Electromagnetism)
,
Organic Semiconductor
,
Patch Antenna
,
Patch Antenna Mobile Phone
,
Phase (Waves)
,
Photodiode
,
Photonic Integrated Circuit
,
PIN Diode
,
Printed Circuit Board
,
Radar / Antennae
,
Radio Frequency Sine Wave
,
Radiodensity
,
Semiconductor
,
Semiconductor Device
,
Semiconductor Device Fabrication
,
Semiconductor Ohmic Contact
,
Semiconductor Risk Assessment
,
Semiconductor Sapphire
,
Semiconductors
,
Short Circuit
,
Smart Antenna
,
Standing Wave
,
Telecommunication
,
Three-Dimensional Integrated Circuit
,
Waveform
,
Waveguide
,
Waveguide (Electromagnetism)
,
Waveguide Light
,
Waveguide Waveguide (Electromagnetism)
,
Wavelength
,
zzsemiconducting materials
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Materials > Semiconducting Materials
,
Electrical > Wireless
2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/19/2023
|
Inventor(s):
Subramanian Iyer
,
Haoxiang Ren
,
Saptadeep Pal
Keywords(s):
Amorphous Silicon
,
Artifical Intelligence (Machine Learning, Data Mining)
,
Artificial Intelligence
,
Artificial Neural Network
,
Bandwidth (Signal Processing)
,
Brain-Computer Interface
,
Brain-Computer Interface Body Mass Index
,
Chipset
,
Clock Signal
,
Computer Aided Design & Manufacturing
,
Computer Aided Learning
,
Computer Architecture
,
Computer Monitor
,
Computer Security
,
Computer Virus
,
Computer Vision
,
Computer-Aided Design
,
Computer-Aided Diagnosis
,
Continuum Mechanics Computer Graphics Collision Detection
,
Digital Signal Processing
,
Doping (Semiconductor)
,
Electrical
,
Electrical Engineering
,
Electrical Impedance
,
Electrical Load
,
Electrical Resistance And Conductance
,
Electrical Resistivity And Conductivity
,
Electronics & Semiconductors
,
Graphics Processing Unit
,
Graphics Processing Unit Analog Computer
,
Human-Computer Interaction
,
Machine Learning
,
Machine Vision
,
Manufacturing
,
Microelectronics Semiconductor Device Fabrication
,
Microprocessor
,
Network Analysis (Electrical Circuits)
,
Network On A Chip
,
Organic Semiconductor
,
Quantum Computer
,
Semiconductor
,
Semiconductor Device
,
Semiconductor Device Fabrication
,
Semiconductor Ohmic Contact
,
Semiconductor Risk Assessment
,
Semiconductor Sapphire
,
Semiconductors
,
Signal Processing
,
Silicon
,
Silicon Dioxide
,
Silicon Working Electrode Perovskite (Structure)
,
Silicon-Germanium
,
Supercomputer
,
System On A Chip
,
Tablet Computer
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Electrical > Signal Processing
,
Materials > Semiconducting Materials
,
Electrical > Electronics & Semiconductors > Circuits
,
Software & Algorithms > Artificial Intelligence & Machine Learning
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