Search Results - materials+%3e+semiconducting+materials

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Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 3/5/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 3/5/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

A Selenium Buffer Method for Making Van Der Waals Contact on CDTE Wafers With High Surface Roughness (Case No. 2025-173)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel method for implementation of Van der Waals contact on commercial CdTe wafers for improved photovoltaic and solar panel production. Background: Cadmium Telluride (CdTe) is a common absorber used for thin-film optoelectronics and photovoltaics, including...

Published: 1/28/2026 | Inventor(s): Yu Huang, Xiangfeng Duan, Bangyao Hu

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Instrumentation & Analysis, Electrical > Sensors, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Materials, Materials > Semiconducting Materials

Doping of Thorium-229 Into High Bandgap Metal Sulfate Material (Case No. 2025-99Y)

Summary: A UCLA researcher in the Department of Physics has developed a novel method for creating high-bandgap materials doped with thorium-229, enabling the development of advanced nuclear clocks. Background: Thorium-229 is the only known isotope with a nuclear transition low enough to be measured using conventional optical techniques. The combination...

Published: 10/9/2025 | Inventor(s): Eric Hudson

Keywords(s): Clock Signal, high-powered laser systems, Laser, laser alignment, Laser Diode, lasers

Category(s): Materials, Materials > Functional Materials, Optics & Photonics, Optics & Photonics > Lasers, Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Quantum Computing, Energy & Environment, Energy & Environment > Thermal, Materials > Nanotechnology, Materials > Fabrication Technologies, Materials > Semiconducting Materials

Fine-Grained Power-Gating Circuitry in FPGA Interconnects (Case No. 2013-181)

Summary UCLA researchers have invented a method and circuit architecture for fine-grained power gating within FPGA (field-programmable gate array) interconnects. By selectively disabling (power gating) unused multiplexers and routing segments at a fine granularity, the approach reduces leakage power in FPGA interconnects while preserving performance...

Published: 9/23/2025 | Inventor(s): Chengcheng Wang, Dejan Markovic

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Computing Hardware, Materials, Materials > Semiconducting Materials

Template-Free Method for Manufacturing of Semi-Regular Functional Micro-Structured Interfaces in Viscoelastic Materials (Case No. 2022-061)

Summary UCLA researchers have developed a template-free, roll-to-roll method for creating semi-regular micro-/nano-scale 3D surface textures on viscoelastic polymer coatings by exploiting ribbing instabilities under shear stress. The process enables scalable manufacture of functional textured surfaces without using molds or templates. Background Micro-...

Published: 9/11/2025 | Inventor(s): CJ Kim, Mohammed Zikry, Jong Ryu

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials

Scalable Van Der Waals Superlattices for Absorbers and Emitters (Case No. 2021-318)

Summary UCLA researchers have developed scalable Van der Waals superlattice materials designed as absorbers and emitters with tunable optical/electronic properties, enabling better control over thermal radiation or photonic emission across a range of wavelengths. Background Existing absorber and emitter materials for photonic and thermal applications...

Published: 10/1/2025 | Inventor(s): Artur Davoyan, Deep Jariwala, Jason Lynch, Pawan Kumar, Francisco Barrera

Keywords(s):

Category(s): Materials, Electrical, Electrical > Signal Processing, Materials > Semiconducting Materials

Large-Area Solution-Processed Ionomer-Interlayered Bulk Monolayer MOS2 Membranes With Thickness-Scalable Bright Luminescence and Dual Electron-Ion Transport (Case No. 2025-281)

Summary: UCLA researchers have developed a novel hybrid 2D material platform that significantly improves the utility and optical performance of monolayer molybdenum disulfide (MoS2) by integrating a Nafion interlayer. Background: Monolayer transition metal dichalcogenides (TMDs), particularly MoS2, have shown promise in the fields of optics and...

Published: 9/25/2025 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Membranes, Materials > Composite Materials, Electrical, Electrical > Flexible Electronics, Electrical > Electronics & Semiconductors, Electrical > Sensors, Chemical, Chemical > Chemical Sensors, Chemical > Polymers

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