Search Results - electrical+%3e+electronics+%26+semiconductors+%3e+circuits

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Quantitatively Decoding Fatigue Levels with a Self-Powered On-Eyelid Magnetoelastic Sensor (Case No. 2025-110)

Summary: UCLA researchers from the Department of Bioengineering have developed an ultrathin, self-powered, and stretchable sensor that adheres directly to the upper eyelid to track fatigue levels in real time. Background: Fatigue-induced impairments have been widely recognized as major contributors to decreased performance, increased error rates,...

Published: 7/16/2025 | Inventor(s): Jun Chen, Jing Xu

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Sensors, Electrical > Signal Processing, Materials > Fabrication Technologies, Medical Devices > Monitoring And Recording Systems

Circuit Printing Technology Portfolio

Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031) A research team led by Professor Ximin He has developed a facile and scalable fabrication strategy to make soft electronics using LM particles. By using a photo-reactive ink containing LM particles and a polymer precursor, the team can precisely layer conductive surfaces...

Published: 7/17/2025 | Inventor(s):

Keywords(s):

Category(s): Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits

Carrier Storage Frequency Divider Using Silicon PIN Diodes (Case No. 2025-023)

Summary: Researchers in UCLA’s Department of Electrical and Computer Engineering have designed and fabricated an innovative device capable of frequency division at the Terahertz range, featuring low power consumption, quadrature outputs, and high sensitivity. Background: Traditional electronic and optical devices struggle to operate at the...

Published: 5/2/2025 | Inventor(s): Sidharth Thomas, Aydin Babakhani, Benyamin Fallahi Motlagh

Keywords(s): Analogue Electronics, Antennas/Wireless, artificial electromagnetic materials, Bandwidth (Signal Processing), Bioelectromagnetics, bioelectronics, bistable electroactive polymer, Cardiac Electrophysiology, Consumer Electronics, Continuous-Wave Radar, Digital Electronics, Digital Signal Processing, Electrical Engineering, Electroactive Polymers, Electrocatalyst, electrochemical sensors, Electrode, Electrode 3D Printing, electrodeposition, electrodes, Electroencephalography, Electroencephalography (EEG), Electroencephalography Microsecond Neurofeedback, Electrolyte, electromagnetic, Electromagnetism, Electron, electron emittance, Electron Gun, Electronics & Semiconductors, energy-efficient wireless communication, Extremely High Frequency, high-frequency signals, image signal processing, Imaging, Integrated Circuit, low-power device, Optical networks, PIN Diode, power conversion efficiency, Radar, Radar / Antennae, Remote Sensing, Semiconductor, Semiconductor Device, Semiconductors, signal decoding, Signal Processing, Silicon, Synthetic aperture radar (SAR), Wireless, wireless communication, wireless connectivity, Wireless Sensor Network, wireless spectrum

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Wireless, Electrical > Signal Processing

Efficient Stochastic Compute-In-Memory Circuit for Multi-Level OR Accumulation (Case No. 2024-122)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel computational hardware that combines stochastic computing with compute-in-memory techniques that improves speed and computational efficiency. Background: In recent years, the need for advanced computational technologies has surged, driven by...

Published: 2/14/2025 | Inventor(s): Sudhakar Pamarti, Jiyue Yang, Soumitra Pal, Puneet Gupta, Tianmu Li, Wojciech Romaszkan

Keywords(s): computational efficiency, Computer Architecture, Integrated Circuit, Logic Gate, neural network, Stochastic Computing (SC)

Category(s): Electrical > Computing Hardware, Electrical > Electronics & Semiconductors > Circuits

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/17/2025 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors

Summary: UCLA researchers in the department of Electrical and Computer Engineering have developed an on-chip clock propagation circuit that allows creation of large-scale fault-robust processor systems which are essential for the next generation of big data solutions. Background: Waferscale processor systems can provide the large number of cores,...

Published: 7/17/2025 | Inventor(s): Puneet Gupta, Saptadeep Pal

Keywords(s): Chipset, Clock Signal, Computer Architecture, Electrical Breakdown, Electronics & Semiconductors, Integrated Circuit, Microprocessor, Network On A Chip, Semiconductor, Semiconductor Device, Semiconductors, Supercomputer, System On A Chip

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors > Circuits

2021-212 Configurable Memory Pool System

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a node processing architecture that allows memory pool to be scalable and allows the integration of heterogeneous technologies downstream. Background: Modern electronic applications require high memory capacity and bandwidth. However, many of these applications...

Published: 7/17/2025 | Inventor(s): Puneet Gupta, Saptadeep Pal, Matthew Tomei, Rakesh Kumar

Keywords(s): Bandwidth (Computing), Dynamic Random-Access Memory, Electrical Engineering, Flash Memory, Latency (Engineering), Magnetoresistive Random-Access Memory, Random-Access Memory, Static Random-Access Memory

Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors

2020-391 Methods for Carrying Out Micromechanical Logic Operations

SUMMARYProfessor Hopkins and colleagues have developed a micromechanical displacement-based logic circuit system that can detect changes in its environment over an extended period of time without external power. The system is small enough to be indiscernible when attached to an object and can be tuned to respond to changes in temperature, pressure or...

Published: 2/14/2025 | Inventor(s): Jonathan Hopkins

Keywords(s):

Category(s): Electrical > Sensors, Mechanical > Sensors, Electrical > Electronics & Semiconductors > Circuits

Flexible Inorganic MicroLED Displays Using Fan-Out Wafer-Level Packaging (Case No. 2020-868)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an efficient and low-cost method to integrate inorganic light emitting diodes into rubber-like substrates that are transparent, flexible and biocompatible. Background: There is a growing demand for modular and flexible light emitting displays for applications...

Published: 6/26/2025 | Inventor(s): Subramanian Iyer, Goutham Ezhilarasu

Keywords(s):

Category(s): Electrical > Displays, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors

2020-861 Superconducting Silicon Interconnect Fabric (Superconducting-IF)

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed a platform that can control heterogeneous integration of dies with 10 μm interconnect pitches and extends the fabrication of Silicon Interconnect Fabric (Si-IF) into the cryogenic and superconducting temperature ranges.BACKGROUNDQuantum computing is an...

Published: 7/17/2025 | Inventor(s): Yu-Tao Yang, Subramanian Iyer

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits

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