Search Results - electrical+%3e+electronics+%26+semiconductors

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Accurate Compute-In-Memory Accelerator With Multi-Level Analog Weight Storage (Case No. 2026-169)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a high-density, multi-level CTT-based compute-in-memory architecture that enables precise, energy-efficient analog computation directly within memory for high-performance computing. Background: Conventional digital processors for artificial intelligence...
Published: 6/3/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali, Samyak Chakrabarty, Vinod Kurian Jacob
Keywords(s): Advanced Computing / AI, advanced computing methods, AI, AI hardware, analog computing, Artificial Intelligence, artificial intelligence accelerators, Artificial Neural Network, CMOS, compute-in-memory, edge computing, Energy Efficiency, high-performance computing, Memory, parallel computing, Transistor, transistors
Category(s): Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors > Memory
Calibration of Analog Multi-Bit Storage Elements Without Off-Chip Components (Case No. 2026-167)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a scalable, energy-efficient technique for high-precision threshold voltage tuning and verification in charge trap transistor arrays using low-overhead on-chip measurement. Background: Charge trap transistors (CTTs) enable non-volatile analog multi-bit...
Published: 6/3/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali
Keywords(s): analog computing, CMOS, compute-in-memory, Electrical, Electrical Engineering, Integrated Circuit, large-area arrays, low latency computing, Memory, Network Analysis (Electrical Circuits), Neuromorphic circuits, programming, pulsed load modulation, scalable fabrication, soft electrical circuits
Category(s): Electrical, Electrical > Computing Hardware, Energy & Environment, Energy & Environment > Energy Efficiency, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors
1-Micron Optical-To-Microwave Frequency Division System for Low Phase Noise Microwave Generation (Case No. 2026-042)
Summary: UCLA researchers in the Department of Electrical & Computer Engineering have designed an integrated, chip-scale architecture that generates ultra-pure, highly tunable microwave signals via microcombs. Background: Ultra-low phase noise and highly tunable microwave signals are critical for next-generation technological infrastructure....
Published: 5/29/2026   |   Updated: 5/29/2026   |   Inventor(s): Chee Wei Wong, Dong IL Lee, Wenzheng Liu
Keywords(s): Extremely High Frequency, Frequency conversion, frequency modulation, high frequency electronics, high-frequency signals, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Monolithic Microwave Integrated Circuit, Radio Frequency, Radio Frequency Coil Human Factors And Ergonomics, Radio Frequency Sine Wave, radiofrequency (RF) coil, Radiofrequency Ablation, radiofrequency signaling, RFID (Radio Frequency Identification)
Category(s): Electrical, Electrical > Signal Processing, Electrical > Quantum Computing, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors
Transformer-Based High-Density, Efficient Power Delivery Architecture for Wafer-Scale Integrated Systems (Case No. 2026-075)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transformer-based, high-density power delivery architecture that enables efficient, scalable, and low-loss energy distribution for next-generation wafer-scale and chiplet-based systems. Background: Chiplet-based and wafer-scale integrated systems demand...
Published: 5/15/2026   |   Updated: 5/15/2026   |   Inventor(s): Subramanian Iyer, Goutham Ezhilarasu, Namkang Lee
Keywords(s): analog computing, Artificial Intelligence, Electrical, energy-efficient, high power electronics, high-performance computing, large-area arrays, power conversion efficiency, Power distribution & grids, Power Electronics, Power Transmission, scalable fabrication, Transformer, wafer-scale, wafer-scale computing, Waferscale Processors
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Energy & Environment > Energy Efficiency, Energy & Environment
Active Electromagnetic Interference Suppression for Magnetic Resonance Imaging-Guided Interventions (Case No. 2026-217)
Summary: UCLA researchers in the Department of Radiological Sciences have developed a software-based active electromagnetic interference suppression solution for real-time MRI-guided interventions. Background: Microwave ablation (MWA) has emerged as the preferred thermal ablation modality for treating non-surgical patients with primary and metastatic...
Published: 4/16/2026   |   Updated: 4/14/2026   |   Inventor(s): Holden Wu, Qing Dai
Keywords(s):  
Category(s): Software & Algorithms, Software & Algorithms > AI Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Image Processing, Medical Devices, Medical Devices > Medical Imaging, Medical Devices > Medical Imaging > MRI, Life Science Research Tools, Life Science Research Tools > Microscopy And Imaging, Life Science Research Tools > Lab Equipment, Medical Devices > Monitoring And Recording Systems, Therapeutics, Therapeutics > CNS and Neurology, Therapeutics > Immunology And Immunotherapy, Therapeutics > Inflammation And Inflammatory Diseases, Mechanical, Mechanical > Instrumentation, Mechanical > Sensors, Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Imaging
Monolithically-Integrated Terahertz Optoelectronics on Quantum Well Substrates (UCLA Case No. 2024-280)
UCLA researchers have developed a monolithically integrated terahertz optoelectronic platform that enables both THz generation and detection on a single chip. This approach offers a compact, scalable solution for applications in wireless communication, imaging, and spectroscopy, overcoming long-standing barriers in THz system complexity and integration. BACKGROUND:...
Published: 3/26/2026   |   Updated: 3/26/2026   |   Inventor(s): Mona Jarrahi, Yifan Zhao
Keywords(s):  
Category(s): Optics & Photonics > Spectroscopy, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Wireless
Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...
Published: 3/2/2026   |   Updated: 3/2/2026   |   Inventor(s): Subramanian Iyer, Samuel Wang
Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
A Wearable Magnetoelastic Patch for Cervical Spines Care (Case No. 2026-076)
Summary: UCLA researchers have developed a soft, wearable magnetoelastic patch designed for real-time, non-invasive monitoring of cervical spine pressure and motion, enabling early detection and personalized care for infants with potential neck or spine disorders. Background: Infant cervical spine injuries present a significant diagnostic challenge...
Published: 2/4/2026   |   Updated: 2/4/2026   |   Inventor(s): Jun Chen
Keywords(s): Neurosurgery/Spine
Category(s): Diagnostic Markers > Pediatrics, Electrical > Electronics & Semiconductors, Electrical > Flexible Electronics, Electrical > Sensors, Materials > Fabrication Technologies, Mechanical > Sensors, Medical Devices > Monitoring And Recording Systems, Software & Algorithms > AI Algorithms, Therapeutics
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