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Search Results - microelectronics
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Intergrated Cavity Optomechanical Thermal Imaging Transducer (Case No. 2023-294)
Summary: UCLA researchers from the Department of Electrical and Computer Engineering have developed a novel transducer for integrated cavity optomechanical thermal imaging. Background: Measuring infrared (IR) radiation provides information across a range of scientific, industrial, and medical applications, and is widely used in thermography, medical...
Published: 3/25/2025
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Inventor(s):
Chee Wei Wong
,
Jaime Flor Flores
,
Talha Yerebakan
Keywords(s):
cavity optomechanics
,
cryogenic cooling
,
Digital Electronics
,
Electronics & Semiconductors
,
electronics packaging
,
Environmental monitoring
,
infrared (IR) radiation
,
Integrated Cavity
,
Microelectronics
,
Nanoelectronics
,
non-invasive imaging
,
Optoelectronic materials
,
opto-electronic systems
,
Optoelectronics
,
Optoelectronics Waveguide (Electromagnetism)
,
optofluidics
,
Optomechanical accelerometer
,
optomechanical oscillator
,
Optomechanical Thermal Imaging Transducer
,
photodetection
,
Power Electronics
,
radiation detection
,
spectral density
,
thermomechanical noise
Category(s):
Electrical
,
Electrical > Imaging
,
Electrical > Electronics & Semiconductors
,
Electrical > Electronics & Semiconductors > Thermoelectrics
Confocal Laser Induced fluorescence diagnostic with annular laser beam for large focal distances
Non-Confidential Brief Confocal Laser Induced Fluorescence Diagnostic With Annular Laser Beam for Large Focal Distances Princeton Docket # 23-4006-1 Laser induced fluorescence (LIF) is routinely used for characterization of plasma sources or in gas dynamic applications. Conventional LIF techniques require access to studied volume from two sides:...
Published: 8/20/2024
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Inventor(s):
Yevgeny Raitses
,
Ivan Romadanov
Keywords(s):
microelectronics
Category(s):
Mechanical/Electrical Engineering
Debris mitigation in laser produced plasmas using three-dimensional manipulation of magnetic topology
Debris Mitigation in Laser Produced Plasmas Using Three-Dimensional Manipulation of Magnetic Topology Princeton Docket # 20-3704 Moore's law dictates that computer chips become ever smaller. The devices that fabricate these chips are facing constraints governed by fundamental physics. In order to achieve small chip size, the next generation...
Published: 11/12/2024
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Inventor(s):
Ahmed Diallo
,
Christopher Smiet
,
Ben Israeli
,
Marien Simeni Simeni
Keywords(s):
microelectronics
Category(s):
Materials
,
Quantum Computing and Electrical Engineering
2007-405 Massively Parallel Assembly of Composite Structures using Depletion Attractions
Summary: Scientists in the Department of Chemistry and Biochemistry at UCLA have identified a way to selectively order and assemble solid microcomponents dispersed in liquids into larger composite devices using attractive interactions that are geometry-dependent. This technique enables the systematic parallel fabrication of complex microstructures...
Published: 2/14/2025
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Inventor(s):
Thomas Mason
Keywords(s):
Composite Material
,
Composite Materials
,
Lithography
,
Manufacturing
,
MEMS
,
Microelectronics
,
Microelectronics
Semiconductor Device Fabrication
,
Nanotechnology
Category(s):
Materials > Composite Materials
,
Materials
,
Materials > Nanotechnology
,
Mechanical
,
Electrical > Mems
A Novel Objective for EUV Microscopy and EUV Lithography
A Novel Objective for EUV Microscopy and EUV Lithography Princeton Docket # 14-2950 Researchers at Princeton Plasma Physics Laboratory (PPPL) have proposed a novel device for extreme ultraviolet (EUV) spectroscopy, EUV microscopy, and EUV lithography at wavelengths below 100 nm. Princeton is seeking an industry partner to develop and commercialize...
Published: 6/11/2024
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Inventor(s):
Manfred Bitter
,
Kenneth Hill
,
Philip Efthimion
Keywords(s):
microelectronics
Category(s):
Mechanical/Electrical Engineering
,
Computer Science and Information Technology