Search Results - wei+wei

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Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 7/23/2026   |   Updated: 7/23/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 7/23/2026   |   Updated: 7/23/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
mmHeat: Autonomous Millimeter-Wave Robotic System for Non-Contact 3D Thermal Conductivity Mapping of Building Envelopes
An autonomous robotic inspection system that uses millimeter wave radar to generate non contact, volumetric 3D thermal conductivity maps of opaque building materials. BACKGROUND: Buildings lose approximately 25 to 30% of heating and cooling energy through hidden envelope defects such as moisture infiltration, insulation voids, and thermal bridges....
Published: 7/22/2026   |   Updated: 7/22/2026   |   Inventor(s): Xiaoyu Zhang, Wenyao Xu, Chi Zhou, Wei Bo
Keywords(s): Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Materials and Chemicals, Technology Classifications > Sensors
Intranasally-Delivered Therapy for Treatment of Amyotrophic Lateral Sclerosis
Intranasal delivery of dantrolene nanoparticles can improve motor neuron function, muscle strength, and movement coordination and can offer therapeutic benefits for treatment of Amyotrophic Lateral Sclerosis (ASL). Problem: ALS a neurodegenerative disease with poor prognosis. ALS is categorized into the familial and sporadic types, with the former accounting...
Published: 7/15/2026   |   Updated: 7/15/2026   |   Inventor(s): Huafeng Wei
Keywords(s): Genetic Disorders, Inflammation, Neurodegenerative Diseases, Neurology, Pulmonary, Small Molecule
Category(s): Technology Classifications > Therapeutics
NEURAL NETWORKS WITH HOMOMORPHIC ENCRYPTION
VAlue proposition Deployment of neural inference over encrypted data—using Fully Homomorphic Encryption (FHE) or Secure Multiparty Computation (MPC)—enables privacy-preserving computation crucial for sensitive applications in healthcare, biometrics, finance, and national security. However, encrypted neural inference has significant physical...
Published: 7/7/2026   |   Updated: 6/30/2026   |   Inventor(s): Vishnu Boddeti, Wei Ao
Keywords(s):  
Category(s): Computer Software
Plasmonic Nanocavitation-enabled Sensor Regeneration for In-situ Biochemical Sensing
THE CHALLENGE Healthcare providers and medical device companies face a major commercialization barrier in deploying continuous biochemical monitoring tools for chronic wound care and other in vivo applications because current sensing technologies fail to operate reliably in real world biological environments. In protein rich biofluids, sensors such...
Published: 6/23/2026   |   Updated: 6/23/2026   |   Inventor(s): Aditya Garg, Wei Zhou, Nie Meitong
Keywords(s):  
Category(s): Technology Classifications > Biotechnology
Stable Cell Line for Large Scale Production of Human Retinoschisin for Ocular Therapy
The National Eye Institute (NEI) seeks research co-development partners and/or licensees for the development of a stable cell line for the production of human Retinoschisin (RS1) for therapeutic applications in ocular diseases. This technology includes the development of a stable cell line for the large-scale production of human Retinoschisin (RS1),...
Published: 6/18/2026   |   Updated: 6/16/2026   |   Inventor(s): Paul Sieving, Alaknanda MIshra, Vijayasarathy Camasamudram, Lisa Wei
Keywords(s):  
Category(s): Application > Research Materials, Application > Therapeutics, Collaboration Sought > Collaboration, Collaboration Sought > Licensing, ResearchProducts > Human Cell Lines, TherapeuticArea > Ophthalmology, TherapeuticArea > Rare/Neglected Diseases
Calcineurin Inhibitor-Antibody Conjugates for Targeted Treatment of Th17 Driven Inflammatory Diseases
The National Eye Institute (NEI) seeks research co-development partners and/or licensees for the development of calcineurin inhibitor-antibody conjugates aimed at treating Th17 driven inflammatory diseases. This technology includes calcineurin inhibitor-antibody conjugates designed for the targeted treatment of Th17 driven inflammatory diseases, such...
Published: 6/18/2026   |   Updated: 6/16/2026   |   Inventor(s): Andrew Dick, Lauren Schewitz Bowers, Robert Nussenblatt, Lai Wei, Igal Gery, Richard Lee
Keywords(s):  
Category(s): Application > Therapeutics, Collaboration Sought > Collaboration, Collaboration Sought > Licensing, ResearchProducts > Antibodies, TherapeuticArea > Immunology, TherapeuticArea > Ophthalmology, TherapeuticArea > Neurology
Optomechanical Acoustic Particle Velocity Sensor
Inspired by biological hearing systems, this invention provides an ultrasensitive, low-noise, miniaturized optomechanical acoustic particle velocity sensor that detects weak velocity signals in confined spaces. By directly sensing acoustic particle velocity rather than pressure, it measures vector components of sound fields, enabling enhanced localization...
Published: 7/24/2026   |   Updated: 4/30/2026   |   Inventor(s): Jian Zhou., Ronald Miles, Wanyin Zheng, Wei Sun, Xiangyu Wei
Keywords(s): Technologies
Category(s): Campus > Binghamton University, Technology Classifications > Electronics, Technology Classifications > Engineering
Optomechanical Acoustic Particle Velocity Sensor
Inspired by biological hearing systems, this invention provides an ultrasensitive, low-noise, miniaturized optomechanical acoustic particle velocity sensor that detects weak velocity signals in confined spaces. By directly sensing acoustic particle velocity rather than pressure, it measures vector components of sound fields, enabling enhanced localization...
Published: 7/24/2026   |   Updated: 4/30/2026   |   Inventor(s): Jian Zhou., Ronald Miles, Wanyin Zheng, Wei Sun, Xiangyu Wei
Keywords(s): Technologies
Category(s): Campus > Binghamton University, Technology Classifications > Electronics, Technology Classifications > Engineering
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