Search Results - wei+wei

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Small-Molecule IL-6 Inhibitors Targeting gp130 for Anti-Cancer Therapy
Blocks IL-6-gp130 Signaling for Cost-Effective Treatment of Autoimmune Diseases and IL-6–Driven Cancers These small-molecule interleukin-6 (IL-6) inhibitors target glycoprotein 130 (gp130) by blocking IL-6-gp130 signaling, delivering a cost-effective therapy for autoimmune diseases and IL-6-driven cancers. IL-6-gp130 signaling drives tumor growth...
Published: 3/2/2026   |   Inventor(s): Chenglong Li, Liguang Mao, Daniel Schultz, Zhihang Shen, Xiaozhi Yang, Wei Zhou
Keywords(s):  
Category(s): Technology Classifications > Human Health Care > Therapeutics
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Strategic Design of Driving and Sensing Through Magnetically Induced Strain for a Resonant MEMS Device and a Resonant MEMS Array
Advantages Enables magnetic-field-based tuning of MEMS resonance frequency and amplitude Supports non-contact actuation using external AC or DC magnetic fields Improves post-CMOS compatibility using magnetostrictive structural materials Enables multifunctional MEMS devices for sensing, tuning, and energy applications Summary Conventional MEMS...
Published: 1/15/2026   |   Inventor(s): Ugur Guneroglu, Mian Wei, Adnan Zaman, Jing Wang
Keywords(s): Sensors, Telecommunication / Wireless Communication
Category(s): Technology Classifications > Engineering > Electrical Engineering, Technology Classifications > Electronics, Technology Classifications > Electronics > Electronics Sensors, Technology Classifications > Electronics > Electronics Telecommunications
Reagents Targeting Neurodegenerative Diseases and Traumatic Brain Injury
Misfolding and aggregation of proteins, such as beta-amyloid (Aß), alpha-synuclein (a-syn), tau and TAR DNA-binding protein 43 (TDP-43), have been strongly correlated with early onset of neurodegenerative diseases such as Alzheimer's Disease (AD), Parkinson's Disease (PD), Frontotemporal Dementia (FTD), amyotrophic lateral sclerosis (ALS) and...
Published: 2/26/2026   |   Inventor(s): Michael Sierks, Lalitha Venkataraman, Wei Xin
Keywords(s): Alzheimer's Disease, CNS Therapeutics, Dementias, Neurodegenerative Disorders, Neurological Disorders, Phage display
Category(s): Bioanalytical Assays, Chemistries & Devices, Diagnostic Assays/Devices, Life Science (All LS Techs), Neurodegenerative Disease Technologies, Non-Cancer Therapeutics, Proteomic Assays/Reagents/Tools
SECURE BIOMETRIC RECOGNITION USING EFFICIENT NEURAL NETWORKS
Value proposition Face Recognition (FR) has become integral to identity management in many practical applications, from unlocking personal devices to facilitating law enforcement and accessing financial services. These systems process sensitive biometric data that, if compromised, can lead to privacy invasions, identity theft, and unauthorized surveillance....
Published: 3/2/2026   |   Inventor(s): Vishnu Boddeti, Wei Ao
Keywords(s):  
Category(s): Computer Software, Informatics, Data Processing/Analysis
Reducing Ischemic Kidney Injury Through Synchronization Modulation Electric Field (SMEF)
Advantages SMEF enables ATP regeneration under ischemic conditions Non-invasive, broad-spectrum applicability to multiple cell and tissue types Enhances organ viability during transplantation Broad Applicability: mechanism is relevant to other ischemic injuries (e.g., heart, brain, liver), opening doors to multi-organ applications Summary Kidney...
Published: 8/8/2025   |   Inventor(s): Wei Chen, Ruisheng Liu
Keywords(s): Organ Transplantation, Renal / Kidney
Category(s): Technology Classifications > Medical > Cell & Tissue Engineering
Just-In-Time Analytics on Large File and Storage Systems
Traditional file systems, such as NTFS and ext3, often struggle to support complex analytics due to limited metadata and the absence of global views. Performing aggregate or top-k queries typically requires exhaustive scanning or pre-built indexes, which are time-consuming and resource-intensive. These limitations hinder efficient data management and...
Published: 1/9/2026   |   Inventor(s): Hao (Howie) Huang, Nan Zhang, Gautam Das, Alexander Szalay, Wei Wang
Keywords(s):  
Category(s): Technology Classifications > Computers Electronics & Software > Computing Architecture, Technology Classifications > Computers Electronics & Software > Databases
Intranasally-Delivered Therapy for Treatment of Amyotrophic Lateral Sclerosis
Intranasal delivery of dantrolene nanoparticles can improve motor neuron function, muscle strength, and movement coordination and can offer therapeutic benefits for treatment of Amyotrophic Lateral Sclerosis (ASL). Problem: ALS a neurodegenerative disease with poor prognosis. ALS is categorized into the familial and sporadic types, with the former accounting...
Published: 9/30/2025   |   Inventor(s): Huafeng Wei
Keywords(s): Genetic Disorders, Inflammation, Neurodegenerative Diseases, Neurology, Pulmonary, Small Molecule
Category(s): Technology Classifications > Therapeutics
Chip-based Nano-optoelectrodes for Optical Voltage Sensing
THE CHALLENGE The challenge in developing reliable, scalable optical voltage sensors lies at the intersection of technical complexity and commercial viability. Current solutions—ranging from fluorescent dyes to random plasmonic nanostructures—face critical limitations: they either require invasive labeling, suffer from photobleaching,...
Published: 10/22/2025   |   Inventor(s): Yuming Zhao, Chuan Xiao, Wei Zhou
Keywords(s):  
Category(s): Technology Classifications > Electronics
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