Search Results - wei+wei

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Optomechanical Acoustic Particle Velocity Sensor
Inspired by biological hearing systems, this invention provides an ultrasensitive, low-noise, miniaturized optomechanical acoustic particle velocity sensor that detects weak velocity signals in confined spaces. By directly sensing acoustic particle velocity rather than pressure, it measures vector components of sound fields, enabling enhanced localization...
Published: 4/30/2026   |   Updated: 4/30/2026   |   Inventor(s): Jian Zhou., Ronald Miles, Wanyin Zheng, Wei Sun, Xiangyu Wei
Keywords(s): Technologies
Category(s): Campus > Binghamton University, Technology Classifications > Electronics, Technology Classifications > Engineering
Optomechanical Acoustic Particle Velocity Sensor
Inspired by biological hearing systems, this invention provides an ultrasensitive, low-noise, miniaturized optomechanical acoustic particle velocity sensor that detects weak velocity signals in confined spaces. By directly sensing acoustic particle velocity rather than pressure, it measures vector components of sound fields, enabling enhanced localization...
Published: 4/30/2026   |   Updated: 4/30/2026   |   Inventor(s): Jian Zhou., Ronald Miles, Wanyin Zheng, Wei Sun, Xiangyu Wei
Keywords(s): Technologies
Category(s): Campus > Binghamton University, Technology Classifications > Electronics, Technology Classifications > Engineering
Molecular Ruler for Quantifying Steady-State and Population Distribution of Photo-Generated Charge Carriers
Provides Quantitative Information on the Steady-State Hot Carriers in Semiconductor and Metal Nanocrystals This DNA-based molecular ruler quantitatively measures the steady-state energy and population distribution of plasmon-generated hot carriers in metal nanocrystals. Photo-generated charge carriers, such as plasmon-generated hot electrons and holes,...
Published: 4/29/2026   |   Updated: 4/29/2026   |   Inventor(s): Wei Wei, Yue Hu
Keywords(s):  
Category(s): Technology Classifications, Technology Classifications > Physical Sciences > Chemistry
Methods To Regulate Metabolism For Treatment Of Neural Injuries and Neurodegeneration
Description of Technology: Axonal injury and subsequent neuronal death underpin the pathology of many neurological disorders from acute neural injuries (motor vehicle crashes, combat related injuries, traumatic brain injuries) to neurological diseases (multiple sclerosis, glaucoma). In the central nervous system (CNS), microglia help respond to CNS...
Published: 4/16/2026   |   Updated: 4/16/2026   |   Inventor(s): Wei Li, Jingxing Ou, Tantai Zhao
Keywords(s):  
Category(s): Application > Therapeutics, Collaboration Sought > Collaboration, TherapeuticArea > Ear, Nose, & Throat, TherapeuticArea > Neurology, Collaboration Sought > Licensing
Language-Agnostic Voice Biomarker Platform for Early Detection of Alzheimer’s Disease and Related Dementias (GloVoAD)
This technology enables early, non-invasive detection of Alzheimer’s disease and related dementias using a large-scale multilingual voice dataset and language-agnostic AI models that analyze vocal biomarkers without relying on speech transcription. BACKGROUND: Early detection of Alzheimer’s disease and related dementias (ADRD) remains...
Published: 4/16/2026   |   Updated: 4/8/2026   |   Inventor(s): Wei Bo, Wenyao Xu, Aditya Challamarad, Harry Lin
Keywords(s): Featured, Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Artificial Intelligence, Technology Classifications > Diagnostics
Beamforming Device and Architectures for Large Language Model Enabled Personal Monitoring
WisperWatcher is a wearable audio-based system that automatically monitors eating behavior by capturing and analyzing mastication and swallowing sounds. Leveraging beamforming techniques combined with Large Audio-Language Models (LALM), it provides accurate, real-time insights into food intake, meal timing, and user disposition while minimizing user...
Published: 4/16/2026   |   Updated: 3/17/2026   |   Inventor(s): Alexander Gherardi, Wenyao Xu, Wei Bo, Shuwei Hou
Keywords(s): Featured, Technologies
Category(s): Campus > University at Buffalo, Technology Classifications > Artificial Intelligence, Technology Classifications > Medical Devices
Small-Molecule IL-6 Inhibitors Targeting gp130 for Anti-Cancer Therapy
Blocks IL-6-gp130 Signaling for Cost-Effective Treatment of Autoimmune Diseases and IL-6–Driven Cancers These small-molecule interleukin-6 (IL-6) inhibitors target glycoprotein 130 (gp130) by blocking IL-6-gp130 signaling, delivering a cost-effective therapy for autoimmune diseases and IL-6-driven cancers. IL-6-gp130 signaling drives tumor growth...
Published: 3/31/2026   |   Updated: 3/2/2026   |   Inventor(s): Chenglong Li, Liguang Mao, Daniel Schultz, Zhihang Shen, Xiaozhi Yang, Wei Zhou
Keywords(s):  
Category(s): Technology Classifications > Human Health Care > Therapeutics
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking
Strategic Design of Driving and Sensing Through Magnetically Induced Strain for a Resonant MEMS Device and a Resonant MEMS Array
Advantages Enables magnetic-field-based tuning of MEMS resonance frequency and amplitude Supports non-contact actuation using external AC or DC magnetic fields Improves post-CMOS compatibility using magnetostrictive structural materials Enables multifunctional MEMS devices for sensing, tuning, and energy applications Summary Conventional MEMS...
Published: 1/15/2026   |   Updated: 1/15/2026   |   Inventor(s): Ugur Guneroglu, Mian Wei, Adnan Zaman, Jing Wang
Keywords(s): Sensors, Telecommunication / Wireless Communication
Category(s): Technology Classifications > Engineering > Electrical Engineering, Technology Classifications > Electronics, Technology Classifications > Electronics > Electronics Sensors, Technology Classifications > Electronics > Electronics Telecommunications
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