Search Results - bandwidth+(signal+processing)

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Direct Carrier Fractional Frequency Synthesizer Using a DiCAD-Based Digital-To-Phase Modulator (Case No. 2025-9AA)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a low-noise, DiCAD-based fractional frequency synthesis system that enables fine frequency resolution and enhanced signal stability for millimeter-wave applications. Background: Millimeter-wave (mmW) communication and radar systems demand carrier frequency...
Published: 10/16/2025   |   Inventor(s): Mau-Chung Chang, Christopher Chen, Adrian Tang, Jia Zhou
Keywords(s): 5G, Automotive, Bandwidth (Signal Processing), Communications Satellite, efficiency bandwidth products, electrically-mediated sensing, Extremely High Frequency, Frequency conversion, frequency modulation, high frequency electronics, high-frequency signals, high-speed communications, Imaging, millimeter-wave, Millimeterwave network, Quantum Computer, Radar, satellite imaging, Signal-To-Noise Ratio, Telecommunication
Category(s): Electrical, Electrical > Signal Processing, Software & Algorithms > Communication & Networking, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms
Miniaturized Batteryless and Wireless Biopotential Recorder with Dynamic Bandwidth and Data Rate Update for Power Optimization (Case No. 2026-015)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a miniaturized, batteryless biopotential recorder with adaptive bandwidth, low power consumption, and synchronized data acquisition for next-generation implantable medical devices. Background: Biopotential signals—including electrocardiograms,...
Published: 10/29/2025   |   Inventor(s): Aydin Babakhani, Roshan Mathews
Keywords(s): Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Clock Signal, Computer-Aided Diagnosis, Data Acquisition, Data Recovery, Electrical, Electrical Engineering, high-data-rate links, Integrated Circuit, low-power architecture, low-power device, Mixed-Signal Integrated Circuit, Monitoring And Recording Systems, Printed Circuit Board, Signal Processing, System On A Chip, Wireless, wireless communication, wireless connectivity
Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors > Circuits, Medical Devices > Monitoring And Recording Systems, Medical Devices
Multilevel Buffered Link (Case No. 2025-284)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel on-chip link that enhances communication performance and energy efficiency in modern integrated circuits. Background: On-chip communication enables data transfer between microchip components and is critical in computing, automotive, and industrial...
Published: 8/20/2025   |   Inventor(s): Sudhakar Pamarti, Chih-Kong Yang, Haris Suhail
Keywords(s): Bandwidth (Signal Processing), buffer layer, Clock Signal, efficiency bandwidth products, Electrical, Electrical Engineering, Energy Efficiency, energy efficient IoT, energy-efficient, high-data-rate links, high-speed communications, IoT communication, large bandwidth, low-power device, Network On A Chip, scalable communication, scalable fabrication, Signaling pathways, Signal-To-Noise Ratio, System On A Chip
Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Computing Hardware, Software & Algorithms > Communication & Networking, Electrical > Signal Processing
Carrier Storage Frequency Divider Using Silicon PIN Diodes (Case No. 2025-023)
Summary: Researchers in UCLA’s Department of Electrical and Computer Engineering have designed and fabricated an innovative device capable of frequency division at the Terahertz range, featuring low power consumption, quadrature outputs, and high sensitivity. Background: Traditional electronic and optical devices struggle to operate at the...
Published: 8/21/2025   |   Inventor(s): Sidharth Thomas, Aydin Babakhani, Benyamin Fallahi Motlagh
Keywords(s): Analogue Electronics, Antennas/Wireless, artificial electromagnetic materials, Bandwidth (Signal Processing), Bioelectromagnetics, bioelectronics, bistable electroactive polymer, Cardiac Electrophysiology, Consumer Electronics, Continuous-Wave Radar, Digital Electronics, Digital Signal Processing, Electrical Engineering, Electroactive Polymers, Electrocatalyst, electrochemical sensors, Electrode, Electrode 3D Printing, electrodeposition, electrodes, Electroencephalography, Electroencephalography (EEG), Electroencephalography Microsecond Neurofeedback, Electrolyte, electromagnetic, Electromagnetism, Electron, electron emittance, Electron Gun, Electronics & Semiconductors, energy-efficient wireless communication, Extremely High Frequency, high-frequency signals, image signal processing, Imaging, Integrated Circuit, low-power device, Optical networks, PIN Diode, power conversion efficiency, Radar, Radar / Antennae, Remote Sensing, Semiconductor, Semiconductor Device, Semiconductors, signal decoding, Signal Processing, Silicon, Synthetic aperture radar (SAR), Wireless, wireless communication, wireless connectivity, Wireless Sensor Network, wireless spectrum
Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Wireless, Electrical > Signal Processing
A Millimeterwave Backscatter Network (Case No. 2024-040)
Summary: UCLA researchers in the Department of Computer Science have developed the first millimeter wave communication network that enables both uplink and downlink communication as well as accurate localization using energy-efficient backscattering techniques. Background: Millimeter wave (mmWave) technology is an emerging wireless communication...
Published: 2/14/2025   |   Inventor(s): Omid Abari, Mohammad Hossein Mazaheri Kalahrody, Haofan Lu
Keywords(s): accurate localization, backscatter node, Bandwidth (Computing), Bandwidth (Signal Processing), efficiency bandwidth products, energy-efficient, energy-efficient wireless communication, Extremely High Frequency, frequency modulation, high-data-rate links, high-frequency signals, large bandwidth, millimeter-wave, Millimeterwave network, mmWave backscatter network, node architecture, Radio Frequency, Waveform, Waveguide (Electromagnetism), Wavelength
Category(s): Electrical, Electrical > Wireless, Electrical > Signal Processing, Electrical > Instrumentation, Energy & Environment, Energy & Environment > Energy Efficiency
2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/17/2025   |   Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal
Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning
Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer
Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...
Published: 2/14/2025   |   Inventor(s): Subramanian Iyer
Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings