Search Results - printed+circuit+board

4 Results Sort By:
Chip-Scale Monolithic Led-Photovoltaic Voltage Boost Conversion (Case No. 2025-033)
Summary: UCLA researchers in the Department of Materials Science and Engineering have developed a non-switching optoelectronic voltage conversion platform capable of voltage boost conversion at low input voltages on a miniature scale. Background: Voltage conversion is crucial for powering industrial systems, home appliances, electric vehicles, and...
Published: 12/4/2024   |   Inventor(s): Pattabhi "Aaswath" Raman, Parthiban Santhanam
Keywords(s): Application-Specific Integrated Circuit, Audio Power Amplifier, Autonomous Energy, clean energy, clean energy consumption, Compressed Air Energy Storage, Concentrated Solar Power, Concentrated Solar Power Chemical Engineering, conversion efficiency photoelectric, Doping (Semiconductor), Electronics & Semiconductors, Energy & Water, Energy Balance (Biology), energy conversion, energy conversion applications, Energy Density, Energy Density Boiling Point, Energy Density Silicide, Energy Density Strong Interaction, Energy Efficiency, energy efficient IoT, Energy Generation & Storage, Energy Generation, Transmission, or Storage, Energy Harvesting, Energy Harvesting Evaporation, energy management, Energy Management System, Energy positive, energy recycle, Energy Recycling, Energy Security , high-powered laser systems, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), interaction-powered, low-power device, Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, nanophotonic, nanophotonic structures, nanophotonics, Network Analysis (Electrical Circuits), Neuromorphic circuits, OLED, Optoelectronics, Optoelectronics Waveguide (Electromagnetism), Organic Semiconductor, people-as-power, photonic, Photonic Integrated Circuit, photonic materials, Photonic structures, Photonics, power amplifier, Power Amplifier Circuit, power conversion efficiency, Power distribution & grids, Power Electronics, Power Transmission, Printed Circuit Board, self-powered wireless sensor solutions, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, soft electrical circuits, thermal circuit, Three-Dimensional Integrated Circuit, wearable electronics, zero-carbon emission power, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Energy & Environment, Energy & Environment > Energy Efficiency, Optics & Photonics
2021-229 Processes, Equipment and Materials Recipes, and Related Know-How to Perform the Silicon-Interconnect Fabric (Si-IF) Chip-Scale Packaging Technology
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel manufacturing process for Silicone-Interconnect Fabric (Si-IF) that is not only scalable, but also robust as it relies on established processing techniques from CMOS technologies. Background: With the rise of computation-heavy applications, such...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer
Keywords(s): Analogue Electronics, CMOS, Consumer Electronics, Digital Electronics, Electronic Packaging, Electronics & Semiconductors, electronics packaging, heterogenous electronic systems, Integrated Circuit Via (Electronics), Interposers, Nanotechnology, Power Electronics, Printed Circuit Board, Printed Electronics, Silicon
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Electrical > Electronics & Semiconductors > Memory
2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...
Published: 1/10/2024   |   Inventor(s): Aydin Babakhani, Seyedmohammadre Razavian
Keywords(s): Active Antenna, Antenna (Radio), Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Application-Specific Integrated Circuit, Communication & Networking, Continuous Wave, Continuous-Wave Radar, Diode, Doping (Semiconductor), Elastomer Static Pressure Pulse Wave, Electronics & Semiconductors, Frequency conversion, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Laser Diode, Light-Emitting Diode, Light-Emitting Diode Monochrome Inkjet Printing, Microelectronics Semiconductor Device Fabrication, Microstrip Antenna, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Optoelectronics Waveguide (Electromagnetism), Organic Semiconductor, Patch Antenna, Patch Antenna Mobile Phone, Phase (Waves), Photodiode, Photonic Integrated Circuit, PIN Diode, Printed Circuit Board, Radar / Antennae, Radio Frequency Sine Wave, Radiodensity, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Smart Antenna, Standing Wave, Telecommunication, Three-Dimensional Integrated Circuit, Waveform, Waveguide, Waveguide (Electromagnetism), Waveguide Light, Waveguide Waveguide (Electromagnetism), Wavelength, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical > Wireless
Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer
Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer
Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings