Search Results - microelectronics

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Synthesis of Neutral Copper Oxide Clusters for High Magnetic Moments
Invention Description Copper is a versatile material that has been used for at least 10,000 years. Copper adopts an oxidation state of either Cu(I) (Cu2O) or Cu(II) (CuO). However, the interactions between copper and oxygen, particularly as they relate to chemical bonding, energetics and magnetic ordering, are still not fully understood. Copper oxide...
Published: 7/22/2026   |   Updated: 7/22/2026   |   Inventor(s): Scott Sayres, Chase Rotteger
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Computing & Information Technology, Microelectronics, Physical Science, Semiconductors, Materials & Processes
An Integrated Inductive Power and Capacitive Data Transfer System
Invention Description Inductive power transfer (IPT) provides safe, wireless power but requires dedicated communication for real-time control. Because traditional wireless methods, including Bluetooth and Wi-Fi, cause unacceptable delays, researchers have designed specialized transfer alternatives. These include inductive methods, which are complex...
Published: 7/13/2026   |   Updated: 7/13/2026   |   Inventor(s): Zhicheng Guo, Guangyu Yan
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Energy & Power, Wireless & Networking, Physical Science, Microelectronics, Medical Devices
OCTANE: On Chip Telemetry-based Anomaly Notification Engine
Invention Description Integrating hardware into safety- and mission-critical systems has sparked strong demand for combined edge and cloud solutions. This ecosystem helps extend product lifespan while maintaining service quality, driven largely by the Silicon Lifecycle Management (SLM) framework. Silicon Lifecycle Management (SLM) ensures hardware...
Published: 7/8/2026   |   Updated: 7/8/2026   |   Inventor(s): Eduardo Ortega, Krishnendu Chakrabarty
Keywords(s):  
Category(s): Computing & Information Technology, Microelectronics, Semiconductor Devices, Semiconductors, Materials & Processes, Intelligence & Security
SMART: Scalable and Modular Architecture for Routing-Aware Testing of FOWLP
Invention Description Fan-out wafer-level packaging (FOWLP) is an advanced packaging technology that connects multiple chiplets using copper (Cu) pillars and redistribution layers (RDLs). As chiplet-based designs become more complex, they require multi-layer RDLs, which are more prone to defects such as opens, shorts, coupling, and electromigration...
Published: 7/6/2026   |   Updated: 7/6/2026   |   Inventor(s): Dhruv Thapar, Partho Bhoumik, Krishnendu Chakrabarty
Keywords(s):  
Category(s): Microelectronics, Physical Science, Semiconductor Devices, Semiconductors, Materials & Processes
PRISM: Priority-first Repair with Intelligent Spare Mapping
Invention Description As the semiconductor industry transitions from monolithic dies to chiplet-based architectures, interconnect density has increased dramatically, making copper pillars and redistribution layers more susceptible to defects such as voids, delamination, and bridging shorts. Conventional repair approaches, including those defined by...
Published: 7/6/2026   |   Updated: 7/6/2026   |   Inventor(s): Partho Bhoumik, Krishnendu Chakrabarty
Keywords(s):  
Category(s): Physical Science, Semiconductors, Materials & Processes, Semiconductor Devices, Microelectronics
Precision Amplifier Design for Pipeline ADCs
Invention Description Analog-to-digital converters (ADCs) translate continuous analog signals into discrete digital numbers. Because modern computing relies on digital data, which is easier to store, manipulate, and transmit, ADCs are the bridge connecting the physical world to electronics. Better ADCs are vital for supporting next-gen technologies...
Published: 6/22/2026   |   Updated: 6/22/2026   |   Inventor(s): Saurabh Dhiman, Arindam Sanyal
Keywords(s):  
Category(s): Artificial Intelligence/Machine Learning, Medical Imaging, Microelectronics, Semiconductors, Materials & Processes, Physical Science
2D Materials for Selectorless Resistive Switching Memory
Invention Description Selectorless resistive random-access memory is crucial for achieving high-density crossbar scaling, however, suppressing sneak path currents (SPCs) without external selector components is still a major challenge. Conventional von Neumann architectures, which transfer data between the process unit towards memory, struggle to keep...
Published: 7/21/2026   |   Updated: 6/22/2026   |   Inventor(s): Feng Yan, Ying-Chen (Daphne) Chen
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Artificial Intelligence/Machine Learning, Computing & Information Technology, Microelectronics, Semiconductors, Materials & Processes
Graphene-Enhanced Composite for High-Temperature Electrical Conductors
Invention Description As technology advances in the military, aerospace and electric vehicle sectors, there is increasing demand for electrical conductors capable of operating at high temperatures. Copper is the most common electrical conductor used in various applications ranging from communication cables and power distribution grids, to electrical...
Published: 5/9/2026   |   Updated: 5/9/2026   |   Inventor(s): Wonmo Kang, Hamzeh Kashani
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Energy & Power, Microelectronics, Physical Science
Gallium Oxide Trench Junction Barrier Schottky Diodes
Invention Description High-voltage power electronic devices require materials and designs that can handle large electric fields while maintaining low power loss and high efficiency. Traditional diode structures often face trade-offs between breakdown voltage, leakage current, and on-resistance, limiting their performance in demanding applications....
Published: 4/15/2026   |   Updated: 4/15/2026   |   Inventor(s): Nidhin Kurian Kalarickal, Advait Gilankar
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Energy & Power, Microelectronics, Physical Science, Semiconductors, Materials & Processes
Permittivity Based Functional Composites for Enhanced Electric Field Management
Invention Description The push for smaller, more efficient, and high-performance power electronics systems is fueling the rapid adoption of Wide Bandgap (WBG) and Ultrawide Bandgap (UWBG) semiconductors. Compared to traditional silicon (Si), these advanced materials allow devices to operate at higher voltages, faster switching frequencies, and elevated...
Published: 3/31/2026   |   Updated: 3/31/2026   |   Inventor(s): Chanyeop Park, Omar Faruqe
Keywords(s):  
Category(s): Advanced Materials/Nanotechnology, Microelectronics, Physical Science, Semiconductors, Materials & Processes, Semiconductor Devices
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