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Search Results - yoan+simon
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Nanoparticle-Based Inductive Heating for Advanced Semiconductor Underfill Curing
Invention Description The semiconductor industry has long relied on thermoset polymers for their superior thermal and mechanical stability in advanced packaging applications such as capillary underfills (CUFs), molded underfills (MUFs), and over-mold compounds. However, as devices evolve toward complex multidie 2D, 2.5D, and 3D architectures, traditional...
Published: 11/18/2025
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Inventor(s):
Yoan Simon
Keywords(s):
Semiconductor Processing
Category(s):
Advanced Materials/Nanotechnology
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Manufacturing/Construction/Mechanical
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Microelectronics
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Physical Science
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Semiconductors, Materials & Processes
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Semiconductor Devices