Nanoparticle-Based Inductive Heating for Advanced Semiconductor Underfill Curing

The semiconductor industry has long relied on thermoset polymers for their superior thermal and mechanical stability in advanced packaging applications such as capillary underfills (CUFs), molded underfills (MUFs), and over-mold compounds. However, as devices evolve toward complex multidie 2D, 2.5D, and 3D architectures, traditional thermal curing struggles with reliability challenges due to repeated heating. To address these concerns, localized or remote curing methods are needed to minimize thermal stress on assemblies.

 

Professor Yoan Simon at Arizona State University has developed nanoparticles and methods to achieve inductive heating for curing underfill resins in semiconductor packaging. By optimizing shell thickness, porosity, and magnetic properties, these nanoparticles provide efficient, superparamagnetic heating that prevents chip performance degradation. This solution balances nanoparticle loading for optimal flowability and curing efficiency, aiming to enhance energy efficiency and protect delicate semiconductor assemblies during packaging. The approach facilitates independent, localized curing without damaging the overall assembly, improving package reliability and performance.

 

These innovative nanoparticles enable remote, localized inductive heating to cure underfill resins in semiconductor packages without harming multidie assemblies.