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Search Results - tsung-fu+yao
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Wafer alignment with AFM metrology
Background One of the major challenges in nanoscale manufacturing is defect control. Optical inspection is not an option at the nanoscale level due to the diffraction limit of light, and without inspection high scrap rates can occur. One solution to this problem is inline metrology using atomic force microscopes (AFM). Single chip MEMS based AFMs have...
Published: 7/11/2024
|
Inventor(s):
Michael Cullinan
,
Tsung-Fu Yao
,
Andrew Duenner
Keywords(s):
Category(s):
Physical sciences > Semiconductor
,
Physical sciences > Testing equipment