Search Results - electromigration

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Simulating Interconnects in Microchips for the Purpose of Rapid Failure Analysis
As electronics become more compact, the issue of electromigration, the accumulation of atoms at the anode of an electronic circuit due to an uneven distribution of current, becomes more prevalent. Devices that undergo electromigration experience physical changes often resulting in short or open circuit failures specifically at the soldering joints....
Published: 2/23/2023   |   Inventor(s): Blake Rogers, Amaneh Tasooji
Keywords(s): Additive Manufacturing, Electromigration, Electronics, Integrated Circuits, Memory, Nanoparticles, Semiconductor Processing, Smartphone, Solder
Category(s): Advanced Materials/Nanotechnology, Computing & Information Technology, Physical Science, Semiconductor Devices, Semiconductors, Materials & Processes