Inteum Company
Links
seedsprint
Visible Legacy
RSS
News & Resources
Inteum Company News
Inteum Library
Subscribe
Search Results - paul+thomas
3
Results
Sort By:
Published Date
Updated Date
Title
ID
Descending
Ascending
Nanodelivery systems for long-term controlled release of pharmaceuticals
This invention describes a nanodelivery system for controlled drug release using biocompatible materials. It features implantable or injectable devices with precise aperture control for zero-order kinetics, ensuring consistent therapeutic delivery over extended periods of time. Background Implantable drug delivery systems offer significant advantages...
Published: 10/11/2024
|
Inventor(s):
Paul Ho
,
Junjun Liu
,
Tengfei Jiang
,
Salomon Stavchansky
Keywords(s):
Category(s):
Life sciences > Therapeutics > Drug delivery
,
Life sciences > Medical technology > Medical devices
Neutralizing Antibodies to Influenza HA and Their Use and Identification
The effectiveness of current influenza vaccines varies by strain and season, in part because influenza viruses continuously evolve to evade human immune responses. While the majority of seasonal influenza infections cause relatively mild symptoms, each year influenza virus infections result in over 500,000 hospitalizations in the United States and Europe....
Published: 10/28/2024
|
Inventor(s):
Robert Bailer
,
Michael Joyce
,
John Mascola
,
Peter Kwong
,
Sarah Andrews
,
Paul Thomas
,
Gwo-Yu Chuang
,
Adam Wheatley
,
Yi Zhang
,
James Whittle
,
Adrian McDermott
Keywords(s):
1
,
2
,
antibodies
,
DB4XXX
,
DBXXXX
,
DC5XXX
,
DCXXXX
,
DXXXXX
,
GROUP
,
INFLUENZA
,
Neutralize
,
That
,
Their
,
Viruses
,
VLXXXX
,
WJXXXX
,
WNXXXX
,
XAXXXX
,
XKXXXX
,
YCXXXX
Category(s):
Collaboration Sought > Licensing
,
Application > Therapeutics
,
Application > Vaccines
,
TherapeuticArea > Infectious Disease
,
ResearchProducts > Antibodies
,
TherapeuticArea > Immunology
Through silicon vias (TSV)
Through silicon vias (TSV) is a key enabling element the provides short vertical interconnects in die stacks to improve electrical performance, power consumption, and form factor for 3D integrated devices. The mismatch of thermal expansion coefficients between the copper via and the silicon wafer can induce significant thermal stresses to degrade the...
Published: 12/8/2023
|
Inventor(s):
Paul Ho
,
Tengfei Jiang
Keywords(s):
Category(s):
Physical sciences > Semiconductor