Search Results - keng+hsu

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Simultaneous Compression and Repeated Orthogonal Shear to Continuously Shape and Join Units of Material for 3D Printing
Background 3D printing has rapidly advanced to a highly accessible technology, revolutionizing industries by enabling the creation of everything from custom prosthetics to entire homes. Its ability to accelerate production by streamlining prototyping has empowered inventors and manufacturers alike to develop highly customized, unique, and innovative...
Published: 8/21/2024   |   Inventor(s): Keng Hsu
Keywords(s):  
Category(s): Physical Science, Manufacturing/Construction/Mechanical, Advanced Materials/Nanotechnology
Method and System to Introduce In-Process Local Thermal Modifications to Fused Filament Fabrication 3D Printing for Approved Surface Finish and Dimensional Tolerance
Background Additive manufacturing, also known as 3D printing, is a fabrication process to build 3D objects layer by layer based on computer aided design (CAD) models, or digital 3D models. Current filament or wire feedstock-based technologies, including the fused filament fabrication (FFF), are desirable for printing thermal plastic materials due to...
Published: 3/7/2023   |   Inventor(s): Keng Hsu, Pu Han
Keywords(s):  
Category(s): Applied Technologies, Physical Science, Manufacturing/Construction/Mechanical, Advanced Materials/Nanotechnology
A Laser-Based Local Preheating Process to Enhance the as Built Strength Isotropy of the Fused Filament Fabrication (FFF) Part
Fused filament fabrication (FFF) is a 3D printing process that adds material layer-by-layer to form a 3D object. Today, 3D printing can produce a range of objects from simple children’s toys to fully-functioning human hearts. However, the products created by FFF still contain a significant amount of error in terms of structural variability during...
Published: 2/23/2023   |   Inventor(s): Keng Hsu
Keywords(s): Mechanical and Manufacturing
Category(s): Computing & Information Technology, Imaging, Physics, Semiconductor Devices, Semiconductors, Materials & Processes, Manufacturing/Construction/Mechanical