Search Results - jeremiah+hebding

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Integration of Through Silicon Vias (TSVs) in a standard CMOS process flow using pre-contact processing
This technology integrates TSV structures into industry standard CMOS manufacturing processes, enabling the fabrication of 3D integrated circuits. Background: Three dimensional (3D) integrated circuits (ICs) use high-density, short through silicon via (TSV) -based vertical interconnects. These 3D components provide new opportunities to design and...
Published: 12/9/2025   |   Inventor(s): Jeremiah Hebding, Megha Rao, Colin McDonough, Mathew Smalley, Douglas Coolbaugh, Joseph Piccirillo, Stephen Bennett, Michael Liehr
Keywords(s):  
Category(s): Campus > NY CREATES, Technology Classifications > Computers
Two-terminal multicolor photo-detectors (PD) and focal plane arrays (FPA)
The state of the art of two-color focal plane arrays (FPAs) are two or three terminal photo detector pixels integrated with electronic readout circuits (ROICs). However, a multicolor (> 2) photodetector pixel requires many more terminals, making it very difficult, if not impossible, to integrate multicolor pixel arrays to ROICs due to the increase...
Published: 2/13/2025   |   Inventor(s): Yong-Hang Zhang, Ding Ding, Elizabeth Steenbergen
Keywords(s):  
Category(s): Physical Science, Semiconductor Devices