Search Results - douglas+coolbaugh

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Integration of III-V Laser and III-V Material into Silicon Photonics Technology
This technology integrates CMOS standard manufacturing processes and Silicon (Si) substrates with direct epitaxial growth of III-V lasers, to improve manufacturing throughput, reduce costs, and produce high-performance, compact photonic integrated circuits (PICs). Background: Photonic integrated circuits (PICs) are chips designed to manipulate light...
Published: 2/26/2026   |   Inventor(s): William Charles, Douglas Coolbaugh, Gerald Leake, Douglas La Tulipe, John Bowers
Keywords(s):  
Category(s): Campus > NY CREATES, Campus > SUNY Polytechnic Institute, Technology Classifications > Optics and Photonics
Integration of Through Silicon Vias (TSVs) in a standard CMOS process flow using pre-contact processing
This technology integrates TSV structures into industry standard CMOS manufacturing processes, enabling the fabrication of 3D integrated circuits. Background: Three dimensional (3D) integrated circuits (ICs) use high-density, short through silicon via (TSV) -based vertical interconnects. These 3D components provide new opportunities to design and...
Published: 1/29/2026   |   Inventor(s): Jeremiah Hebding, Megha Rao, Colin McDonough, Mathew Smalley, Douglas Coolbaugh, Joseph Piccirillo, Stephen Bennett, Michael Liehr
Keywords(s):  
Category(s): Campus > NY CREATES, Technology Classifications > Computers