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Integration of Through Silicon Vias (TSVs) in a standard CMOS process flow using pre-contact processing

This technology integrates TSV structures into industry standard CMOS manufacturing processes, enabling the fabrication of 3D integrated circuits. Background: Three dimensional (3D) integrated circuits (ICs) use high-density, short through silicon via (TSV) -based vertical interconnects. These 3D components provide new opportunities to design and...

Published: 12/9/2025 | Inventor(s): Jeremiah Hebding, Megha Rao, Colin McDonough, Mathew Smalley, Douglas Coolbaugh, Joseph Piccirillo, Stephen Bennett, Michael Liehr

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Category(s): Campus > NY CREATES, Technology Classifications > Computers