Collagen IV binding Vascular Endothelial Growth Factor (VEGF) Bioconjugates for Vascularization

NU2022-150

INVENTORS

  • Kyle M. Koss*
  • Yangxi Liu
  • Jason A. Wertheim*

SHORT DESCRIPTION

Bioconjugates that localize and concentrate VEGF within scaffold structures to support long-term cell survival and promote vascularization in tissue engineering applications

BACKGROUND

The development of effective vascularization strategies is crucial for the success of tissue engineering and regenerative medicine, particularly in the creation of artificial organs and 3D printed tissues. Traditional methods often face challenges in localizing and maintaining growth factors, such as VEGF, at therapeutic concentrations to promote angiogenesis without inducing adverse effects like clotting or scarring. This invention addresses these challenges by providing a targeted approach to deliver VEGF within scaffold environments.

ABSTRACT

Northwestern researchers have created methods for the localization and concentration of vascular endothelial growth factor (VEGF) within scaffold structures. The invention features bioconjugates that utilize collagen binding peptides (CBP) and VEGF to enhance vascularization in 2D and 3D cultures. By creating self and co-assemblies of VEGF to collagen IV, these bioconjugates overcome the limitations of traditional recombinant expression methods and ensure sustained growth factor presence, promoting long-term cell survival and angiogenesis.

APPLICATIONS

  • Enhances vascularization in artificial organs and 3D printed tissues
  • Provides sustained growth factor presence for improved cell survival

ADVANTAGES

  • Allows the multiple targeting moieties to be conjugated to VEGF
  • Increases concentrations of VEGF within 3D structures
  • Supports angiogenesis while minimizing clotting and scarring risks
  • Can be substituted with alternative growth factors (ANG1) and bioactive peptides (QK)
  • Adaptable to various tissue engineering and regenerative medicine scenarios

IP STATUS

US patent pending.

Patent Information: