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Fidelity-Driven Runtime Thermal Management for Near-Sensor Architectures
Background Advances in imaging and vision processing technologies have enabled countless devices, such as phones, headsets, cameras, and drones, to be commercial staples. As high-performance imaging needs grow, management of energy consumption becomes a concern. This has motivated a trend towards three-dimensional “stacked” integrated circuit...
Published: 2/23/2023   |   Inventor(s): Venkatesh Kodukula, Saad Katrawala, Britton Jones, Robert LiKamWa
Keywords(s):  
Category(s): Computing & Information Technology, Physical Science, Energy & Power, Imaging