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Ceramic Thin Film Embedded Capacitors
Method for size reduction, increased functionality, improved high frequency performance, cost savings and increased reliability of typically crowded electronic circuit boards Background: As electronic circuit boards become crowded with numerous discrete components, additional advances require utilization of the inner spaces of electronics packaging...
Published: 9/30/2021   |   Inventor(s): Junghyun Cho, Bahgat Sammakia, Roy Magnuson, Mark Poliks
Keywords(s): #SUNYresearch, CleanTech, Technologies
Category(s): Technology Classifications > Electronics, Campus > Binghamton University