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Search Results - nick+munizza
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Method of Providing a Thick Film Polyimide with No Mechanical Means for De-Bonding from Carrier
Background Polyimide is used as a substrate for flexible electronics and flexible solar cells. The processing of polyimides has previously been challenging because of their low solubility in common solvents and their high softening temperature. De-bonded polyimide at a thickness of less than 30 microns is difficult to handle without creasing or...
Published: 2/23/2023
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Inventor(s):
Nick Munizza
,
Michael Marrs
,
Xan Henderson
Keywords(s):
Bio-Technology
,
Materials and Electronics
,
Mechanical and Manufacturing
,
Medical Devices and Imaging
Category(s):
Physical Science
,
Semiconductors, Materials & Processes
,
Energy & Power