Search Results - james+mertens

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Fixture for In Situ Electromigration Testing during X‐ray Microtomography
Invention Description The reliability of microelectronic packaging is increasingly challenged by the phenomenon of electromigration in lead-free solder joints, where high current densities cause material transport and eventual failure. Traditional characterization methods, such as optical and scanning electron microscopy, are restricted to two-dimensional...
Published: 2/26/2026   |   Updated: 9/23/2015   |   Inventor(s): Nikhilesh Chawla, James Mertens
Keywords(s): Algorithm Development, Electronics, Manufacturing, Materials and Electronics, Mechanical and Manufacturing, Medical Devices and Imaging, Modeling, Nephrology, Software
Category(s): Semiconductors, Materials & Processes, Physical Science