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Integration of III-V Laser and III-V Material into Silicon Photonics Technology
This technology integrates CMOS standard manufacturing processes and Silicon (Si) substrates with direct epitaxial growth of III-V lasers, to improve manufacturing throughput, reduce costs, and produce high-performance, compact photonic integrated circuits (PICs). Background: Photonic integrated circuits (PICs) are chips designed to manipulate light...
Published: 2/26/2026
|
Inventor(s):
William Charles
,
Douglas Coolbaugh
,
Gerald Leake
,
Douglas La Tulipe
,
John Bowers
Keywords(s):
Category(s):
Campus > NY CREATES
,
Campus > SUNY Polytechnic Institute
,
Technology Classifications > Optics and Photonics