This family of capacitor technologies combines ultrathin dielectric nanolaminates, nanostructured electrodes, and cushion layers to deliver high energy density, ultra-fast cycling, and compact, reliable solid-state capacitors. By overcoming the size, efficiency, and safety limits of today’s designs, they enable next-generation electronics from 5G systems to EVs and medical implants.
Background: Energy storage devices face trade-offs between energy density, power density, and reliability. Batteries offer high energy but slow cycling and short lifetimes. Conventional capacitors provide high power and fast cycling but are constrained by low energy density and breakdown issues. Electrochemical supercapacitors improve on lifetime but fall short on energy density, while MLCCs, electrolytic, and tantalum capacitors face porosity, leakage, conflict mineral reliance, corrosive electrolytes, or costly stacking. The industry urgently requires a compact, safe, and scalable capacitor solution that delivers both high energy density and capacitor-like cycling stability.
Technology Overview: • RB732 introduces a nanolaminate cushion (Al₂O₃/TiO₂) to stabilize ultrathin high-k dielectrics, enabling nanoscale capacitors with superior breakdown strength and reliability. • RB585 uses ALD-grown oxide nanolaminates on nanostructures to fabricate defect-free, high-capacitance dielectric films compatible with both flexible and rigid electronics. • RB539 extends this platform by incorporating conducting nanostructures (e.g., CNTs, ZnO nanorods, or Cu nanofibers) coated with TiO₂/SiO₂ or Al₂O₃/TiO₂ nanolaminates via ALD. This architecture maximizes effective surface area, supports high-k dielectrics, and minimizes leakage for much higher energy density, while remaining solid-state, electrolyte-free, and scalable. Together, these approaches create solid-state capacitors with high energy density, rapid charge/discharge capability, and long-term cycling stability in compact, manufacturable formats.
Advantages: • Achieves nanoscale dielectric thickness while maintaining high breakdown strength • Energy density up to 10 Wh/L, rivaling hybrid supercapacitors and approaching batteries • High power density up to 27.3 kW/kg with rapid cycling • >100,000 cycles with minimal degradation for long lifetime • Wide operating range from −40°C to 200°C • Capacitance >1 mF in compact footprints with nanostructured electrodes • Reduced leakage currents via engineered TiO₂/SiO₂ pairings • Manufacturable at low temperatures (<200°C) for cost efficiency • Eliminates electrolytes and conflict minerals like tantalum • Estimated cost ~$0.35 for 1 mF, 450 V unit, far below MLCC equivalents
Applications: • Embedded capacitors in IC packages and advanced 3D electronics • High-frequency RF and 5G/mmWave systems • Automotive and EV modules for regenerative braking and acceleration • Wearable and implantable medical devices • Miniaturized aerospace and defense power systems for UAVs and avionics • Grid-scale renewable stabilization and integration • Portable consumer electronics requiring fast charging and long lifetimes
Intellectual Property Summary: • RB732: US Provisional Application 63/673,771 – Filed July 21, 2024, Status: Pending; US Utility Application 19/275,953 – Filed July 21, 2025, Status: Filed • RB585: US Patent 11,664,172 – Application 16/369,810, Filed March 29, 2019, Granted May 30, 2023; US Utility Application 18/303,019 – Filed April 19, 2023, Published US 2023-0253164 A1, Status: Allowed July 23, 2025 • RB539: US Provisional Application 62/650,318 – Filed March 30, 2018, Converted April 9, 2018, Continued April 19, 2024, Status: Prototype Development
Stage of Development: • RB732 – Prototype validated with stabilized ultrathin dielectrics • RB585 – Patented, lab-validated, one application allowed • RB539 – Prototype with demonstrated >2 Wh/L, potential up to 10 Wh/L
Licensing Status: This technology family is available for licensing.
Licensing Potential: High-value opportunity for capacitor manufacturers, electronics integrators, and energy storage companies seeking next-generation solid-state capacitor solutions that combine energy density, power density, and long lifetimes in compact, sustainable formats.
Additional Information: Performance test data, dielectric breakdown studies, and nanostructure characterization available upon request.
Inventors: Tara P. Dhakal, Ganesh Gudavalli, Pravakar Rajbhandari, James Turner, Wendy Reyes Ramos, Mahesh Nepal