Method to Grow Reliable Ultrathin Ceramic Capacitors

 Method to Grow Reliable Ultrathin Ceramic Capacitors  
 
 
 Problem Statement:  
 
Conventional capacitors struggle with miniaturization. Thinner dielectrics increase leakage and failure, while current materials and processes are hard to scale and not suited for 3D or flexible electronics.  
 
Technology Overview:  
A new method for making ultrathin ceramic capacitors using a “nanolaminate cushion” that prevents breakdown and enables reliable, high-capacitance devices on flat or 3D surfaces. Uses low-temperature ALD for flexible and embedded applications.
 
 
 
 
 
 Advantages:  
 
  • 100× higher capacitance per volume than MLCCs
  • Stable at sub-10 nm thickness, low leakage
  • Works on 3D and flexible surfaces
  • Low-temperature process (<300 °C)
  • No electrolytes or rare materials
  • Lower ESR/ESL for high-frequency use  
Technology Validation Stage:
  • Prototype
 Applications:  
 
  • Embedded capacitors in PCBs, chips, and interposers
  • 5G and RF systems requiring low ESL decoupling
  • Wearable and implantable devices with flexible, biocompatible power storage
  • Automotive, aerospace, and defense electronics with size and reliability constraints
  • Power management circuits as an alternative to tantalum and electrolytic capacitors
 
IP/Publications:
Patent pending
Patent Information:
Direct Link:
https://canberra-ip.technologypublisher.com/tech/Method_to_Grow_Reliable_Ultr athin_Ceramic_Capacitors
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For Information, Contact:
Matthew Quimby
Binghamton University
mquimby1@binghamton.edu