High-Density Neurostimulation System

High-density cluster electrode technology that enables a high degree of scalability and customization for neurostimulation applications.

Background:

Existing skin-surface neurostimulation is achieved by a single electrode that performs bulk stimulation on the entire tissue in the neurostimulation area. It does not have the capability to control the depth or direction of the stimulation, resulting in poor targeting of muscles. Next-generation neurostimulation electrodes should be enhanced to enable programmable electrode sizes, shapes, and optimized localization. Currently, there are no scalable electrodes that allow these characteristics to be modified “on-the-fly”, or without replacing the electrodes themselves.

Technology Overview:

Researchers at the University at Buffalo have developed a high-density neurostimulation system capable of controlling field geometry, depth and enabling stimulation vectoring. The system is composed of a collection of high-density electrodes that can be activated in specific geometric patterns and a distributed neurostimulation hardware that can control hundreds to thousands of electrodes, minimizing the number of wires for miniaturized and wearable applications.

https://buffalo.technologypublisher.com/files/sites/7732_in-part_image.jpg

Header image is purely illustrative. Source: BillionPhotos, Adobe Stock.

Advantages:

• Depth control of stimulation
• Stimulation vectoring (tuning of stimulation direction)
• High resolution neurostimulation
• Targeting of smaller muscles
• Electric field shape control
• Distributed control of high-density sensor systems
• First high-density neurostimulation technology
• Enables a much broader utility for surface neurostimulation

Applications:

• Neurorehabilitation and neuromodulation (e.g., stroke, Parkinson’s, pain, functional recovery)
• Neuromuscular stimulation and wearable rehab/performance systems
• Neural sensing and electrophysiology (EMG, high-density, multi-sensor platforms)
• Human–machine interfaces and immersive control systems
• High-density electrical control and field-based technologies

Intellectual Property Summary:

Provisional Patent Application 63/967,151 filed January 23, 2026

Stage of Development:

TRL 3-4

Licensing Status:

Available for license or collaboration