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Creation of Diffractive Lenses and Fresnel Zone Plates in Semiconductor Processes and their use for Spectral Filtering

This invention focuses on incorporating diffractive optical elements, like a Fresnel zone plate, into the semiconductor fabrication process, particularly in the back-end-of-line (BEOL) stage. By doing so, it enhances the functionality of semiconductor devices by enabling advanced imaging and spectroscopic capabilities directly on the chip. This approach...

Published: 10/22/2024 | Inventor(s): Mohamed ElKabbash

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Category(s): Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Lens & System Design, Technology Classifications > Imaging & Optics > Materials & Fabrication

Fabrication of Metasurfaces in Standard CMOS Foundry Processes

This invention discloses a novel approach to integrating metasurfaces with standard Complementary Metal-Oxide-Semiconductor (CMOS) processes, a significant advancement in the field of photonics and nanofabrication. This approach leverages a bulk CMOS foundry process for the fabrication of metasurfaces and experimental results show that three primary...

Published: 5/7/2024 | Inventor(s): Mohamed ElKabbash

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Category(s): Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Materials & Fabrication

Advanced Radiative Cooling System for CMOS Chips Using Integrated Metal-Optic Layers

This invention leverages recent advancements in nanophotonics and electronics to develop an advanced radiative cooling system for Complementary Metal-Oxide-Semiconductor (CMOS) chips with minimal change to the CMOS chip design. This cooling system incorporates metal-optic layers directly into the chip’s architecture within bulk CMOS foundry processes,...

Published: 4/24/2024 | Inventor(s): Mohamed ElKabbash

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Restricted Area Printing by Ink Drawing (RAPID) for Solution-Processed Thin Films

Researchers at the University of Arizona have developed Restricted Area Printing by Ink Drawing (RAPID), a novel confined-volume printing technique for solution-processed thin films. This method utilizes confined plates to apply external stimuli, such as temperature and electric fields, allowing for precise control over the crystallization process during...

Published: 10/28/2024 | Inventor(s): Adam Printz, Matthew Dailey, Subham Dastidar

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Category(s): Technology Classifications > Materials > Processing, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Semiconductors

Wide Area Spectralelectrochemical Measurement of Thin Film Semiconductors for Electronic Band Structure Analysis

This invention is a rapid, nondestructive detection method for properties of semiconductor stacks (including perovskite stacks for use in photovoltaics) which can be used at speeds and scales relevant for manufacturing to check product quality. This invention could reduce/remove barriers for manufacturing scale-up and production of high quality robust...

Published: 6/20/2024 | Inventor(s): Erin Ratcliff, Michel De Keersmaecker, Neal Armstrong

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Category(s): Technology Classifications > Energy, Cleantech & Environmental > Renewable Energy, Technology Classifications > Energy, Cleantech & Environmental > Renewable Energy > Solar/Photovoltaic, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Sensors and Detection > Inspection, Technology Classifications > Materials > Processing, Technology Classifications > Sensors & Controls

In-line Analytical Measurements for High-Throughput Manufacturing of Solar Cells, Enhancing Scalability of Next Generation Semiconductor Thin Film Stacks

A “stick and peel” removable electrochemical probe is used for solvent-free characterization of semiconductor films or optoelectronic devices and configured for use in situ and/or in operando. The invention may be used to analyze electronic materials such as a metal halide perovskite, an organic semiconductor, a nanocrystalline (quantum...

Published: 3/12/2024 | Inventor(s): Michel De Keersmaecker, Erin Ratcliff, Neal Armstrong

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Defect Characterization for Semiconductors, including Perovskites, in Operando or during Manufacturing, using 'Peel and Stick' Probe with Enhanced Sensitivity

This technology involves the use of a removable ‘peel and stick electrolyte’ probe for detecting defects in perovskite materials. This is an improvement on previous technology that increases sensitivity of defect detection in device-relevant triple cation perovskites. Background: The development of next-generation flexible optoelectronic...

Published: 3/12/2024 | Inventor(s): Michel De Keersmaecker, Erin Ratcliff, Neal Armstrong

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SmartPrint Polymer Material and Design for the Connection of Separate Optical Chips

This technology is a further development of interconnect polymer waveguides for photonics packaging and integration. Here, a flexible optical substrate is attached and aligned to individual photonic chip components to form an optical waveguide. The waveguide comprises a refractive index contrast (RIC) polymer directly patterned using a photolithography...

Published: 3/12/2024 | Inventor(s): Linan Jiang, Dong-Chul Pyun, Robert Norwood, Tristan Kleine, Julie Frish, Thomas Koch, Stanley Pau, Roland Himmelhuber, Abhinav Nishant, Kyungjo Kim, Sasaan Showghi

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"Stick and Peel" Probe Properties of Perovskite Material Properties for Manufacturing Scale-Up and Quality Control

A “stick and peel” removable electrochemical probe is used for solvent-free characterization of semiconductor films or optoelectronic devices. The invention may be used to analyze electronic materials such as a metal halide perovskite, an organic semiconductor, a nanocrystalline (quantum dot) thin film, metal oxides, a material blend or...

Published: 3/12/2024 | Inventor(s): Michel De Keersmaecker, Erin Ratcliff, Neal Armstrong

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Ultrafast Optical Switches and Transistors

The inventors have demonstrated attosecond switching speed in a light field-induced phase transition of a dielectric system. This switching occurs under ambient conditions and provides for data encoding by synthesized laser pulses. This technology may be used for ultrafast optical-based switches and data transfer with petahertz speed and optical transistors....

Published: 3/12/2024 | Inventor(s): Mohammad Hassan, Dandan Hui, Husain Alqattan

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