This invention is an integrated optical processor with diffractive elements through a CMOS chip. This technology addresses challenges associated with deploying free-space optical processors, such as diffractive networks, at optical wavelengths by integrating diffractive elements into the back end of the line of a CMOS chip. Leveraging the advanced fabrication capabilities of CMOS foundries, this approach enables the production of multiple layers with high alignment accuracy, essential for optical wavelength operations. This innovative hybrid diffractive-CMOS approach overcomes the alignment and integration challenges of traditional free-space optical processors, while also offering the potential for reconfigurable operation, making it a promising solution for a wide range of optical computing and imaging applications. Diffractive photonic processors are currently considered a major contender in the field of image and signal processing and computing. There are serious efforts in integrating them with electronic devices such as cell phones for various applications like decompressing high resolution images, edge detection, drone detection, and image delivery through scattering media like fog. Background: Free-space optical processors leverage the spatial and spectral information of light to perform complex computational tasks at high speeds. However, a significant challenge in deploying these systems is the precise fabrication and alignment of multiple diffractive layers. Achieving sub-wavelength alignment accuracy is crucial for proper functioning, as misalignments can introduce errors and degrade performance. Current fabrication methods face difficulties in maintaining mechanical robustness, achieving high-resolution features, and ensuring accurate layer-to-layer alignment, especially for multilayer designs operating in the visible spectrum. The proposed invention addresses these challenges by integrating diffractive elements into the back end of the line of a CMOS chip. CMOS sensor arrays can be integrated on the same chip to serve as detectors, providing a compact and integrated solution. Applications:
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