Search Results - srikanth+rangarajan

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Direct-to-chip diamond-backed cooling for AI and HPC chiplets
This invention integrates a crystalline diamond- or sapphire-backed heat spreader directly onto silicon wafers prior to chip fabrication, paired with a sealed fluid chamber that delivers direct-to-chip liquid cooling without thermal interface materials. The result is a low-resistance, high-efficiency cooling path that improves reliability, reduces energy...
Published: 10/24/2025   |   Inventor(s): Kanad Ghose, Bahgat Sammakia, Srikanth Rangarajan
Keywords(s): Technologies
Category(s): Campus > Binghamton University
Fingerprinting Metal Powders: Non-Destructive Evaluation for Reliable 3D Printing
This invention introduces a real-time, non-destructive method to fingerprint metal powders for additive manufacturing. Using thermal signals from a modulated laser system, it accurately identifies powder composition, reuse status, and oxidation levels, preventing failed builds, reducing waste, and improving quality control. Background: High-quality,...
Published: 9/24/2025   |   Inventor(s): Scott Schiffres, Srikanth Rangarajan, Sina Ghadi
Keywords(s): Technologies
Category(s): Campus > Binghamton University