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Search Results - payam+sabbaghi
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Radiative Heat Dissipation Between Macroscale Metallic Surfaces Via Near-Field and Thin-Film Effects
Background Modern microelectronics continue to trend towards increasing power usage and decreasing size. As a result, heat dissipation has become a significant bottleneck for microelectronics advancement. An increasing amount of heat needs to be transferred without sacrificing the small size of the device. Previous attempts at solving this problem have...
Published: 2/23/2023
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Inventor(s):
Liping Wang
,
Payam Sabbaghi
Keywords(s):
Category(s):
Physical Science
,
Advanced Materials/Nanotechnology
,
Energy & Power
,
Manufacturing/Construction/Mechanical