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Low Temperature Wafer Bonding
Currently, the fabrication of semiconductor devices requires immensely complicated procedures, performed on high quality materials, under extreme conditions. Consequently, the semiconductor industry is constantly looking for improved methods of and superior materials for device fabrication. Researchers at Arizona State University have nucleated and...
Published: 2/23/2023   |   Inventor(s): Nicole Herbots, Robert Culbertson, James Bradley, Murdock Hart, David Sell, Shawn Whaley, Vasudeva Atluri
Keywords(s):  
Category(s): Physical Science, Semiconductors, Materials & Processes