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Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Background In the evolving field of electronic manufacturing, the integration of various components into cohesive systems presents significant challenges. Traditional methods often rely on soldering and adhesives for bonding, but these approaches have limitations in terms of reworkability, thermal constraints, and adaptability to diverse materials....

Published: 3/26/2024 | Inventor(s): Joseph Brown, Kody Wakumoto, Geoffrey Garcia

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Category(s): Advanced Materials/Nanotechnology, Manufacturing/Construction/Mechanical, Physical Science, Semiconductors, Materials & Processes