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Search Results - ibrahim+tekin
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TSV based on-chip antennas
PAGE TITLEA Novel Wireless On-Chip Interconnect System PAGE SUMMARY Current commercial systems-on-chips (SoC) integrate an increasingly large number of predesigned cores and their number is predicted to increase significantly in the near future. In order to scale future many core chips to hundreds or even thousands of cores, new and sophisticated...
Published: 11/24/2020
|
Inventor(s):
Baris Taskin
,
Vasil Pano
,
Ibrahim Tekin
,
Kapil Dandekar
,
Yuqiao Liu
Keywords(s):
Category(s):
Communications & Cybersecurity
,
Electrical Engineering & Electronics
,
Hardware, Circuits & Sensors
,
Hardware, Circuits & Sensors > Hardware: Antennas
,
Hardware, Circuits & Sensors > Hardware: Microprocessor Design
,
Hardware, Circuits & Sensors > Hardware: Superconductors
,
Electrical Engineering & Electronics > EE: Circuits
,
Electrical Engineering & Electronics > EE: Components
,
Communications & Cybersecurity > Comm: Antennas