Ultrafast Nanoscale Stroboscopic Electron Microscopy System Using Temporal and Spectral Pulse Shaping

This technology is a method to enhance the temporal and energy resolution of electron pulses in ultrafast electron microscopy using pulse shaping techniques. A combination of optical components such as diffraction gratings and spatial light modulators allows for the temporal structuring of optical pulses which interact with and modulate an electron beam such that it produces multiple sub-pulses with distinct properties. This makes it possible to capture multiple temporal events in a single experimental setup and allows for imaging at resolutions in the femtosecond range. Furthermore, this technology is designed to be easily adaptable into existing ultrafast electron microscopy setups, allowing for cost-effective temporal resolution enhancement. 

Background: 
Ultrafast Electron Microscopy (UEM) is pivotal in observing dynamic processes at extremely short timescales in fields such as material science, biology, and physics. It is crucial to the research of dynamic, short-timescale processes, and can be used, among other applications, to study chemical reactions, analyze biological processes in live cells, and test fundamental theories of physics. Traditional UEM systems face limitations in temporal resolution due to the intrinsic properties of electron sources and detection systems. Enhancements in ultrafast electron microscopy resolution can enable and improve research across a wide variety of disciplines, but solutions are often expensive, technologically complex, and difficult to integrate with existing laboratory setups. This technology provides a novel, cost-effective solution designed to be adapted to existing laboratory equipment.

Applications: 

  • Materials Science
  • Biology
  • Chemistry
  • Physics


Advantages: 

  • Capable of imaging on femtosecond range of temporal resolution
  • Can capture multiple temporal events in a single setup
  • Cost-effective
  • Adaptable to existing laboratory setups
Patent Information: