Clean, fast, and accurate transfer of 2D materials, are a critical technology in production of all devices that need 2D materials on top of it. Existing technologies are inefficient in accurately placing a 2D material without cross contamination or mechanical damage to neighboring devices on chip. Thus, a precise and contamination free approach of placement of 2D-materials is needed.
Researchers at GW have developed a novel transfer method for 2D materials utilizing a micro-stamping technique to significantly reduce the lateral cross-contamination area on the substrate receiving the 2D material and improving spatial accuracy. Here, they experimentally demonstrate that using a conventional micro-stamper can significantly improve the transfer of multilayer and few layer 2D materials, reliably reducing cross-contamination often caused by other transfer methods. Compared to the state of the art transfer methods, their 2D printer method shows a virtually cross-contamination-free (>99% clean) transfer methodology on a substrate size of up to ~10s of µm range. This capability will significantly increase the range of application of 2D materials.
Figure 1. Schematic of the 2D printer is illustrated
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