The Problem:
Power semiconductors are the fundamental component in power electronic systems. The temperature of a power semiconductor is the major design consideration when designing a power electronic system, however, the temperature impossible to measure during actual operation. This leads to a variety of reliability issues including catastrophic failure of systems and extreme economic costs due to downtime. Competing technologies have sought to solve this problem in a variety of ways, many of which are complex or are too inaccurate or slow to provide significant benefit.
The Solution:
A researcher at the University of Alabama has developed a miniature temperature sensor and monitoring unit that monitors the temperature of the chip at high speed during actual high voltage operation. This invention allows operators and designers to improve the reliability of power electronic systems and to also reduce the size, weight and cost through more accurate design.
Benefits: